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Offered in a compact 5.5 mm by 5.85 mm by 7 mm package, the TCUT1630X01 and TCUT1800X01 are AEC-Q101 qualified optical sensors for automotive and industrial applications. The triple-channel TCUT1630X01 includes an infrared emitter and three phototransistor detectors located face to face in a surface-mount package. With a taller dome than previous-generation devices and an additional channel for a vertical push function or indexing tab, the device is ideal for turn and push encoding. The quad-channel TCUT1800X01 includes two infrared emitters and four phototransistor detectors, and it can detect up to 16 positions for absolute and incremental encoding.

Both sensors can detect motion, speed, and direction. They can be used as position sensors for encoders in high temperature automotive environments close to motors, in addition to turn interior knobs, ignition locks, adaptive headlights, and electric power steering (EPS) systems. In industrial applications, the devices are ideal for monitoring gas or water meters and for detecting the status of doors, panels, and inserted coins or credit cards.

The TCUT1630X01 and TCUT1800X01 deliver a typical output current of 1.3 mA and operate at a wavelength of 950 nm. The optical sensors feature a 3 mm gap width and apertures of 0.3 mm, and they offer a wide temperature range of -40 °C to +105 °C. With a Moisture Sensitivity Level rating of 1 (MSL1), the TCUT1630X01 and TCUT1800X01 have an unlimited floor life. Compatible with reflow solder processes according to JEDEC-STD-020D, the devices are RoHS-compliant and halogen-free.

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AS7221 is the industry’s first integrated white-tunable smart lighting manager. The AS7221 is equipped with an industry-first embedded tri-stimulus CIE XYZ color sensor to enable precise color sensing with direct mapping to the CIE 1931 color space. This smart lighting manager is a fully integrated luminaire control system, compatible with standard 0-10V inputs and enabled for IoT connectivity and network control through standard clients such as Bluetooth Smart, ZigBee or WiFi, through a complete Smart Lighting Command Set. LED control for spectral tuning is implemented via direct PWM channel outputs, resulting in a high-precision solution that slashes development and integration time when compared with more bulky discrete component approaches.

The AS7221 is the first extension to ams’ recently announced Cognitive Lighting™ smart lighting manager family. The compact AS7221 will be available in a 5x5mm LGA package, for flexible integration into both luminaires and larger replacement lamps. The device provides precise color point tuning, smoothly controlling CCT transitions between configured warm and cool white LED strings within a luminaire. In addition to the color- and CCT-tuning functions, the AS7221 includes automatic configuration support for ams’ TSL4531ambient light sensor for turnkey daylighting capabilities.

Lighting manufacturers designing with the AS7221 can now quickly integrate high-precision CCT, or “Kelvin-tuning”, capabilities into their Internet of Things (IoT) smart lighting offerings. The versatile architecture, which includes an I2C extension interface, positions the AS7221 to deliver Internet of Awareness™ IoT sensor hub platform capabilities for sensing functions such as air quality, temperature, occupancy, and presence.

Key applications include:
1) intelligent lighting control in the office; 2) intelligent lighting control of display cabinets; 3) intelligent lighting control of classrooms

“The next generation of lighting will be defined by three key characteristics: controllability, adaptation and connected architectures,” said Tom Griffiths, Senior Marketing Manager at ams. “Our new family of smart lighting managers meet those criteria. With this latest entry, we are addressing the luminaire manufacturers’ critical time-to-market challenge for developing and deploying a spectrally tunable luminaire that is cost-effective, accurate, and which smoothly integrates into the Internet of Things”.

Key features of the AS7221 include:
• Tri-stimulus XYZ color sensor for direct mapping into the CIE color space
• Serial UART for simple connection to standard networks and wireless
• Fully network-enabled architecture with high-level, driverless command set for a wide array of advanced integrated luminaire controls
• I²C expansion capability to enable IoT sensor-hub platform functionality

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Offered in a small 4.5 x 4.4mm land grid array package, the ultra-low power AS7262 visible range sensor provides six calibrated spectral channels. Because of its attractive price point, the new multispectral sensors open the door to testing and use in a very wide range of consumer and real-world field applications. Key solution spaces include material and product authentication, product quality and integrity as well as material content analysis in the near-infrared (NIR) and visible spectrums. As the world’s first series of cost-effective multispectral sensor-on-chip solution, AS7262 opens the way for a new generation of spectral analyzers for consumer and industrial applications.

Key applications include:
1) detection of water turbidity of home appliance, such as washing machine and dishwasher; 2) detection of freshness of fruit; 3) identification of products to prevent counterfeit.

Key competitiveness:
1) The multispectral sensors employ a new fabrication technique which enables nano-optical interference filters to be deposited directly on the CMOS silicon die with extreme precision. This interference filter technology used for the sensors offers extremely precise and reproduceable filter characteristics which are stable over both time and temperature and are much smaller and more cost-effective than the components typically used in today’s spectral analysis instruments.
2) The AS7262 six-channel visible light sensor with integrated intelligence provides a calibrated digital output over an I2C or UART interface. It measures light intensity at six wavelengths in the visible light spectrum: 450nm, 500nm, 550nm, 570nm, 600nm and 650nm. This device includes an electronic shutter with LED drive circuitry, which means that device de-signers can accurately control the light source and the spectral sensing functions with a single chip.
3) The small size of the new multispectral sensors combined with their low power consumption enable measurement equipment OEMs to develop new product types that take advantage of these unique attributes. For instance, bulky laboratory-grade analysis equipment can now be replaced by convenient handheld form factors. In factories, samples which today have to be removed from the production line and taken to a laboratory for chemical analysis or quality test-ing will be tested in-line by new small, robust spectral analyzers based on the multispectral sen-sors.

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Teledyne e2v has launched its ground breaking new Emerald family of CMOS global-shutter image sensors. This new product family features the world’s smallest true global shutter pixel on the market today (2.8µm), offering customers improved performance and reduced system costs due to the smaller optical format and the higher resolutions packed into the Emerald’s standard formats.
Teledyne e2v’s Emerald family comprises a 16MP (4096 x 4096 pixels) – the first to be released, a 12MP (4096 x 3072 pixels) and an 8MP (4096 x 2160 pixels). These high resolution formats are offered within an industry first, 1 inch optical format, which can be interfaced with a compact C Mount lens, making them ideal for a wide range of industrial applications.
The whole Emerald family features the same pixel, processing, readout structures and ceramic Land Grid Array (LGA) package to simplify integration and offer camera makers the advantage of a reduced development cost for derived product offerings. The lead products will also feature dedicated embedded features that are the result of working closely with our customers to anticipate their future needs and the trends of the machine vision market. These features include High Dynamic Range (HDR) modes, 8/10/12 bit ADC, modulable high-speed outputs (>47fps at 10 bits, full 16MP resolution), and a number of convenient power-saving modes. These sensors deliver Quantum Efficiency of more than 70%, a full well capacity of over 7ke- and readout noise 2.8e-, with the possibility through a new multi-read technique to get well below 2e-, astonishing for a 2.8µm global shutter pixel!
This new generation of image sensors also marks a significant improvement of Dark Signal Non Uniformity (DSNU), which is more than 10 times improved when compared to previous CMOS products. This enables cameras to perform better in high temperature environments and enable long exposures to be used in low-light applications such as microscopes or outdoor cameras for surveillance, speed or traffic applications.

The factory industry produces each year thousand billions of devices and goods with continuous constraints on price, quality and time-to-market. The machine vision industry will face in the next decade the most important challenge since the global automation of machines. The race to the highest-speed and reliable solutions has started and is part of the so called industry 4.0.
We can expect a three-fold impact of the disruptive CMOS Global Shutter pixel of Emerald.
• The most visible would be a quite straightforward impact on the worldwide manufacturing capabilities by reducing the cost of expensive inspection cameras and optic systems thanks to its overall size reduction contribution of more than 20% smaller compared to most advanced existing sensors.
• The second obvious benefit of outstanding electro-optic performance for high resolution sensor is the ability to check more objects simultaneously at faster pace and therefore improving the manufacturing throughput.
• The last but not least impact of this cutting edge technology and products is the capability to extent the field of applications by pushing back the noise performance beyond current standards.

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The ultimate low power magnetic angle sensor is now released: it is called the MA780. It is the newest member of the MagAlpha family, made by MPS. MagAlpha are extremely compact magnetic sensors (typically packaged in QFN3x3) which provide the absolute direction of the magnetic field. Facing a simple permanent magnet mounted on a shaft, it becomes an angle sensor. The magnetic field is measured with built-in Hall effect devices. The particularity of the MagAlpha is that is transforms the Hall effect signal into a digital angle by phase detection, without any ADC or complex computing. This method is extremely fast, so that the sensor wakeup time is extremely short (a few 10 us). This allows the MA780 to operate in pulsed mode with very short ON time. As a consequence the average current consumption at, say 1kHz or 100 Hz refresh rate is the smallest in the world today. This sensor is targeted to battery powered and mobile applications requiring angle sensing, from manual control, knobs, valve or any rotating mechanism where power consumption is critical.

A few low power magnetic sensors are available in the market today, which deliver the magnetic field components, not the angle. It is up to the user to compute an angle using a microcontroller or any external device. This operation is tricky and requires computing power. The MA780 is the sensor delivering directly an absolute angle that consumes the smallest power. For instance the MA780 can provide an angle with more than 9 bit of effective resolution (+/- 3 sigma), with an active time of only 130 us. It means that the user can have a sensor with a 100 Hz refresh rate consuming only 0.1 mA. No competing product comes close to this figure. Among the rare low power magnetic angle sensor, the closest competing sensor (the AS5050A from AMS) has an active time of 500 us. Besides, the MA780 offers a large variety of operation mode: from an fully externally controlled timing, to a completely automated power management where the MA780 wakes up at predefined time intervals. If a motion alarm is required, a flag telling that a certain angle threshold was crossed is available. Finally the MA780 can be packages in a QFN2x2, making it the smallest magnetic sensor with angle output ever.

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The SPSDEVK1 provides a complete environment for the development and evaluation of IoT applications using smart passive sensors (SPS). It brings together a number of smart battery-free sensor solutions with a UHF reader and a dedicated software environment, to enable developers design, build and evaluate next-generation applications that integrate a wide range of passive sensors generating real-time data for the IoT.

The kit is available it two configurations; the SPSDEVK1-PCB-GEVK includes the UHF SPS Reader Hub (SPSDEVR1-8), 8 UHF antennas (SPSDEVA1-W) and 50 SPS Temperature Tags (SPSXT001). The SPSDEVK1-GEVK includes the SPS Reader, 2 UHF antennas with RF cables, 20 SPSxT001PCB Temperature Sensors, 20 SPSxT001PET Temperature Sensors, 20 SPSxM001CER Temperature Sensors, 20 SPSxM001FOM Moisture Sensors, and 20 SPSxM001PET Moisture Sensors. Both kits are supplied with a 12V DC power supply and an Ethernet Cable.

The dedicated software environment developed for the SPSDEVK1 integrates ON Semiconductor’s TagReader software, which can automatically detect the type and variant of SPS connected to the Reader. The TagReader software will acquire data from each SPS and display it graphically. The Graphical User Interface provides a simple way to configure each sensor and all of the system’s parameters, giving full control over the data measurement functions.

This development kit addresses a growing need in the rapidly emerging IoT market, to provide a fast and flexible way to develop a complete and optimized IoT application. It is applicable to a wide range of applications and gives developers and manufacturers the ability to build an entire IoT system based on Smart Passive Sensors using a proven platform.

ON Semiconductor’s smart passive sensor (SPS) enables the monitoring of various parameters such as temperature, moisture, pressure or proximity at the IoT network edge where running wires or replacing batteries may be impractical. When interrogated by an RF reader (the ON Semiconductor TagReader), the SPS “‘harvests” energy from the measuring signal, and then delivers a rapid and highly accurate reading from the sensor. This cost-effective solution has significant benefits over other technologies, and offers the potential to revolutionize low-power IoT sensing designs.

SPS allow reading over greater distances than is possible with NFC and do not require a battery - a limitation of Bluetooth-based technologies.

SPSDEVK1 is a complete development kit that includes reader, antennas, various sensor tags, power supply, Ethernet cable and software. It is a complete sensing turnkey solution that removes the need to source IoT solutions from multiple vendors. With SPSDEVK1, users can save both development time and cost by enabling the rapid configuration and modification of multi-sensor IoT applications, even first-time users can quickly and easily configure a system to measure, aggregate and analyze data for multiple fully wireless, battery-free IoT applications.

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NXP's highly integrated automotive radar MCU and RF front-end technology (RFCMOS or BiCMOS) provide customers with a scalable solution for ultra-short, short, medium and long -radars. This will deliver high precision and security for the applications of anti-collision, lane change assist, autonomous emergency braking, 360° radar wraparound detection and adaptive cruise control. The main products include:

 S32R Automotive Radar MCU: provides greater precision and safety, enabling vehicles to detect and identify objects for a new range of semi-automatic functions;
 TEF810x 77GHz Rader Transceiver: Highly integrated single chip for stamp-size radar sensors  MR3003 Radar Transceiver: specifically developed for front or corner radar applications in automated driving, where high resolution and long-range capabilities are needed.
NXP’s full suite of radar transceivers completes the industry’s only radar portfolio based on both BiCMOS and advanced RFCMOS process technologies, to match carmaker requirements with a complete system solution. Complemented by the NXP S32R automotive radar processing platform, networking ICs and power management solutions, the NXP radar portfolio enables automakers to develop systems ranging from small, compact radar sensors through high resolution imaging radar sensing applications, enabling broad penetration of radar across the full range of car models. It is estimated that more than 50 percent of all car radar modules shipped in 2017 have utilized NXP radar technology.
Automotive radar can accurately provide relevant data for car driving environment, so it is the core of the automotive ADAS system both now and in the future. The ultra-small size of NXP 77GHz automotive radar chip allows it to be mounted almost invisibly anywhere in the vehicle, with its power consumption 40% lower than traditional one, which makes the design and installment more convenient.

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The Smart Wireless Condition Monitoring Accelerometer combines a sensor, data processing and radio into one compact, battery-operated device that measures both vibration and temperature data. It uses the LoRaWAN™ communication protocol, offering a simple, reliable and secure means of expanding condition-based monitoring into plant areas where the cost to install wired systems is prohibitive, making notification available to existing process control and information systems.

Specifications		Note
All values are typical at +24°C, 80Hz and 3.3VDC excitation unless otherwise stated. TE Connectivity reserves the right to update and change these specifications without notice.
Range	±20g	Typical
Frequency Response	1-8000Hz	±1db
Frequency Response	Frequency Response 0.4-10000Hz	±3db
Natural Frequency	34000Hz
Non-Linearity	±1%FSO
Transverse Sensitivity	5%
Shock Limit	5000g
Residual Noise	0.001g RMS	从 1Hz 至 10kHz的宽频
Temperature Response	±10%
Operating Temperature	-20°C to +85°C
Battery	CR17450 3V 2400mAh
USB 1.1	5V 100mA
Frequency	1-50000Hz	User configurable
Resolution	12-bit
Period	6 hours	User configurable
Region	EU 868Mhz or USA 915MHz	Other regions available upon request
Activation	OTAA	ABP available upon request
Activation Keys	Factory Defined	Customization available upon request

It is widely used in IIoT applications, e.g. in traditional Paper Machine Line, equipping 18 Wired Sensor, containing 18 Connectors, 20 Meters of Cable (>100 meters across plant floor) and 2 Radial modules to monitor the machine health status. Now they are replaced by only 18 Smart Wireless Condition Monitoring Accelerometers, thus reducing plant maintenance & installation costs. Same scenarios applied in Wind, Bev., Power and O&G industries.

Competitive Advantages
1.Compact sensor with small physical footprint
2.Reduced installation costs – no wires or cables
3.Certified for harsh environments
4.Cost effective monitoring for large plant areas
5. Up to 5-year battery life, low power consumption radio operating on mainstream protocols, like LoRaWAN™
6.Remotely control and two-way data transmission
7. Velocity notification for detecting faults such as imbalance, misalignment, and looseness
8. Configurable periodic measurements
9. Embedded FFT processing and signal analysis for default notification generation

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The ZMOD4410 Gas Sensor Module is designed for detecting total volatile organic compounds (TVOC) and monitoring indoor air quality (IAQ). It consists of a gas sense element and a CMOS signal conditioning IC. The module’s sense element consists of heater element on a Si-based MEMS structure and a metal oxide (MOx) chemiresistor. The signal conditioner controls the sensor temperature and measures the MOx conductivity, which is a function of the gas concentration.

The measurement results can be read via an I2C interface with the user’s microprocessor, which processes the data to determine the TVOC concentration, IAQ rating and estimated carbon dioxide (eCO2) level. With its low operating current consumption, the ZMOD4410 is an excellent choice for low-voltage and low-power battery applications. Built-in nonvolatile memory (NVM) stores the configuration and provides space for arbitrary user data.

Physical Characteristics • Wide operation temperature: -40°C to 65°C
• Supply voltage: 1.7V to 3.
• Package: 12-
• Assembly size: 3.0 x 3.0 x 0.7

Typical Applications
• Indoor air monitoring
• Monitor home, office, and personal environments for healthy conditions and comfort
• Detect hazardous materials and unhealthy conditions (e.g. fumes from construction materials)
• Automation based on indoor
More than 12 years of proven stability and reliability. The ZMOD4410 platform is an integrated digital gas sensor ideal for high volume consumer and industrial IAQ applications, it supports high sensitivity (0.1ppm to 1000ppm), long term stability (5+ years), comparing to the electrochemical technology is around 2 years, and 3 years for PID technology. ZMOD4410 supports fast response time, typical 5 seconds, and the power consumption is less than 14mW

IDT can provide different software options to support different applications.

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CUI’s AMT21 and AMT23 series are rugged, high accuracy absolute modular encoders outputting 12 bits or 14 bits of absolute position information. The AMT21 series, featuring high speed RS-485 communication, and the AMT23 series, designed with a Synchronous Serial Interface (SSI), are based on CUI’s proprietary capacitive sensing technology. The capacitive platform offers a highly durable and accurate position feedback solution that is resilient to dirt, dust, an oil typically encountered in motion applications. Housed in compact packages measuring as small as 1.53 x 1.12 x 0.40 inches (39 x 28 x 10 mm) with a locking hub for easy installation, the two series boast a low current draw of 8 mA at 5 V and accuracy of ±0.2 mechanical degrees, making them ideally suited for battery-powered industrial, robotics, and automation applications. Both models come in either radial or axial orientations and carry an operating temperature range from -40 to +105°C. Thanks to the digital nature of these absolute encoders, the AMT21 and AMT23 are highly customizable and configurable with the ability to program the direction of rotation and zero position via CUI’s AMT Viewpoint™ software. The AMT’s simple design further reduces the time-consuming tasks of mounting and alignment to mere seconds with the One Touch Zero™ feature.

Designed to mate with a broad range of motors, the AMT21 and AMT23 are also featured as a kit that contains 9 sleeve bore options ranging from 2 mm to 8 mm, two simple mounting tools, and one standard and one wide baseplate with multiple pre-drilled mounting hole patterns, offering users the ultimate flexibility in their design. CUI’s AMT21 and AMT23 absolute encoder series offer engineers the ultimate flexibility in their design without the tradeoffs of optical or magnetic encoder technologies. Featuring 9 sleeve bore options capable of mating with a broad range of motors, a single AMT21 or AMT23 encoder can be implemented across a variety of applications, whereas standard optical encoders typically only offer a single bore diameter per encoder, greatly reducing their versatility and increasing inventory costs. The digital nature of the AMT encoders also makes them highly customizable and configurable when paired with CUI’s AMT Viewpoint software. This gives engineers added flexibility when designing in the field with several configurable features available at the click of a button. Mounting and alignment of a typical optical encoder can take upwards of 15 minutes during assembly, which the AMT21 and AMT23 encoders reduce to mere seconds thanks to their simple design and One Touch Zero feature. This saves additional time and cost during the manufacturing process. The AMT21 and AMT23 series are further based on CUI’s proprietary ASIC technology which gives them added durability and resistance to the dust, dirt, and oil that can plague optical encoders in industrial environments. Their compact package and low current draw also makes them ideally suited for battery-powered applications where current consumption is a major design consideration. In addressing the durability issues of optical encoders and the accuracy shortcomings of magnetic encoders, the AMT21 and AMT23 absolute encoders deliver the best of both worlds, thanks to their rugged, high accuracy design.

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Silicon Labs’ Si117x optical biometric sensors provide advanced heart rate monitoring (HRM) coupled with electrocardiogram (ECG) capabilities to address a wide range of wearable fitness and wellness products. The Si117x sensor modules combine ultra-low power, high sensitivity and exceptional integration, making them ideal for smart watches and wrist-based, patch-type and other wearables requiring long battery life and enhanced HRM accuracy. To simplify development and speed time to market, Silicon Labs’ complete, end-to-end sensing solution features the Si117x sensor module, an HRM algorithm, Wireless Gecko SoCs for Bluetooth connectivity, and an easy-to-use, wrist-based development kit with sample code and example projects.

All-day HRM is a key requirement for health and fitness wearables. By tracking heart rate throughout the day, end users and health-care providers can analyze physiological patterns, detect health issues before they become problems and consider lifestyle adjustments. Addressing the market need for power efficiency, the Si117x sensors consume less than 50 µA (sensor and LED combined) while performing continuous HRM. A built-in buffer and accelerometer synchronization capabilities save even more system-level power. The sensors’ industry-leading power efficiency enables developers to use smaller batteries in wearable designs without significantly impacting the device’s battery life during continuous monitoring.

The Si117x sensors provide enhanced HRM accuracy for a better end user experience. The sensors offer fast sampling speeds, a high signal-to-noise ratio (SNR >100 dB), and the ability to cancel out ambient noise and erroneous data, resulting in high-quality signals that make it easier to track heart rates despite challenging physiologies, varying skin tones and the presence of tattoos. A more accurate view of the HR waveform enables biometrics beyond traditional HRM, including heart rate variability (HRV), stress analysis and pulse volume.

The Si117x modules’ high level of integration simplifies wearable design and makes it easier to synchronize multiple sensor measurements without adding significant system cost or board area. Each module supports up to four distinct LEDs (which can be driven simultaneously) and offers four independently programmable LED drivers (scaling from 1.7 to 310 mA). Additional built-in features include a photodetector, 24-bit ADC with >100 dB dynamic range, I2C and SPI digital interfaces, programmable event interrupt engine, synchronization engine, host communications processor and inputs for two external photodiodes.

The Si117x sensors support Silicon Labs’ proprietary, motion-compensated HRM algorithm optimized for wrist-based sensing and to run on EFM32 Gecko MCUs and EFR32 Wireless Gecko SoCs supporting Bluetooth Low Energy (LE). This unparalleled integration enables system-level power and performance optimization and reduces time to market for developers seeking to add HRM capabilities to their wearable designs. Samples and volume quantities of the Si117x sensors are available in a 3.7 mm x 7 mm 28-pin LGA module. Silicon Labs also offers Si118x optical biometric sensors with an integrated photodiode in a clear 3 mm x 3 mm QFN package. To simplify development and performance evaluation, Silicon Labs provides a variety of wrist-based ECG and PPG development kits, a Bluetooth-enabled HRM evaluation watch, and an Android-based Triple Heart Application that captures data from multiple devices.

As the market for health and fitness wearables continues to grow, developers want complete biometric sensing solutions that work flawlessly without the complexities of integration and algorithm development. Silicon Labs is the only supplier to provide a complete HRM and ECG sensing solution comprising the sensor module, HRM algorithm and wireless SoC capable of transmitting measurements over Bluetooth Low Energy for health monitoring and analysis.

The Si117x modules combine the lowest power optical heart-rate monitoring (HRM) solution in the industry with best-in-class sensitivity and integration. This unparalleled integration enables system-level power and performance optimization and reduces time to market for wearable makers that are adding HRM capabilities to their products.

Personal medical device makers are looking to enhance and differentiate their wearable products with advanced health analysis features. The ECG waveform is the gold standard for cardiac measurement and analysis, and Silicon Labs’ Si117x sensors bring this technology to wrist-based wearables in a cost-effective, power-efficient manner.

The Si117x sensors can perform single-channel ECG measurements alongside optical HRM, enabling developers to add additional value and gather more physiological information from end users. By combining ECG and optical HRM measurements, the Si117x sensors enable developers to unlock new potential biometrics for wearables. For example, bio-impedance measurements can be used to predict a variety of biological variables such as stress levels, hydration and body fat.

By making measurements in the same device and with the same time reference, the Si117x sensors allow developers to combine ECG and bio-impedance capabilities with optical photoplethysmogram (PPG) measurements to derive valuable physiological parameters. This exceptional single-device integration makes it easier to synchronize sophisticated health measurements and deliver innovative biometric capabilities to consumers without adding significant cost or board area to space-sensitive wearable products.

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The EV12AQ600 is a 12b ADC featuring an analog input bandwidth greater than 5GHz with a flexible cross point switch at the input allowing it to be used as a single channel at 6GSps, a dual channel at 3GSps or a quad channel at 1.5GSps.

Additionally, its use of the Efficient Serial Interface ESIstream protocol on 8 lanes at 12Gbps and an innovative synchronization solution, the EV12AQ600 greatly eases system design where a large number of synchronized channels is needed. The EV12AQ600 is offered in a small CBGA 16x16mm package and in commercial, industrial, military and space QML-Y grade.

With these advanced specification and capabilitied the EV12AQ600 offer a fitting solution for advanced test and measurement solution including high definition oscilloscopes and digitizers; industrial testing application such as telecommunication testing, automotive radar target simulator; and space payload including earth observation SAR radar and telecommunication payload.

Customers can design systems that operate the EV12AQ600 independently or synchronized, in quad-channel at 1.5 Giga Sample per second (GSps), dual-channel at 3 GSps or single-channel at 6 GSps mode, while only having to qualifying one ADC. Even more, in some cases, one design using the channel count flexibility can address multiple requirements. This makes the EV12AQ600 highly capable and customizable, suitable for ultra-wideband microwave backhaul systems, data acquisition systems and test and measurement applications. The EV12AQ600 is the first 12-bit ADC to feature a Cross Point Switch (CPS), which allows the device to operate its four cores simultaneously, independently or paired, to assign its 6 GSps sampling speed across the user’s desired channel count. This flexibility allows system designers to develop advanced systems on the ground and, for the first time ever, design with a quad-channel ADC for space applications, using the rad-tolerant version. In addition to the multi-channel CPS functionality, the EV12AQ600 contains the proven chain synchronization feature as seen in some of Teledyne e2v’s most recent data converters. This feature allows it to meet the growing trend of increasing channel counts in large phased-array and Multiple-Input, Multiple-Output (MIMO) systems.

Its impressive analog input bandwidth surpassing 5GHz makes possible direct RF sampling up to the C-band. Direct RF sampling translates into the removal of down-converters and thus optimizes the RF component count in the system. Thus extensive SWAP-C (Size, Weight, Power and Cost) savings can be realized when using this new ADC.

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The SGM8263-1 (single) and SGM8263-2 (dual) bipolar-input operational amplifiers achieve very low noise density of 4.5nV/ with a low distortion of 0.0001% at 1kHz. The SGM8263-1/2 offer rail-to-rail output swing to within 190mV of supply rails with a 2kΩ load, which increases headroom and maximizes dynamic range. The devices also have a high output drive capability of ±55mA.

SGM8263-1/2 have ultra low offset voltage and ultra low offset voltage drift over temperature. The maximum offset voltage is 8.5μV. SGM8263-1/2 are very suitable for amplifying low noise and low amplitude signal.

The devices operate over a wide supply range of 4V to 36V or ±2V to ±18V, on only 2.5mA of supply current per amplifier. The SGM8263-1/2 operational amplifiers are unity-gain stable and provide excellent dynamic behavior over a wide range of load conditions. The SGM8263-1 is available in Green SOT-23-5 and SOIC-8 packages. The SGM8263-2 is available in Green SOIC-8 package. They are specified from -40°C to +85°C temperature range.

SGM8263-1/2 high precision, high linearity & low noise operational amplifiers offer superior performance on ultra low offset voltage (Max: 8.5μV), ultra low input offset voltage drift (10nV/℃), low noise (4.5nV/ ) and low distortion (0.0001%) at 1kHz comparing to competitions. SGM8263-1/2 are truly the top performance operational amplifiers in this class, suitable for a wide range of applications such as temperature measurements, pressure sensors, precision current sensing, electronic scales, strain gauge amplifiers, medical instrumentation, thermocouple amplifiers, handheld test equipment, etc.

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ADI’s AD9208/AD9172 28-nanometer CMOS ADC/DAC chipset is part of a new series of high speed data converter, which can meet the demands of gigahertz bandwidth applications and the increased spectral efficiency demands of 4G/5G multi-band wireless communications base stations. Based on 28-nanometer CMOS technology, the chipset delivers industry leading bandwidth and dynamic range to cover the largest number of signal bands, which Sets New Performance Benchmarks for Next Wave Wideband Software Defined Systems.

The dual 14-bit AD9208 is optimized for wide input bandwidth, high sampling rate, excellent linearity, low power in a small package with an industry standard interface, allowing designers flexibility in selecting processor platforms and signal processing partitioning using ADI’s wideband RF data acquisition technology. With sampling speeds up to 3.0 GSPS, the new A/D converter facilitates direct RF signal processing architectures and provides high oversampling. This simplifies front-end filtering, thereby reducing receiver design complexity and overall system cost. The AD9208 enables direct RF sampling of wideband signals beyond 6 GHz, allowing more flexibility and the ability to eliminate mixer stages and simplifies system design with an internal clock divider and optional RF clock output.

The dual 16-bit, 12 GSPS AD9172 provides direct-to-RF synthesis up to 6GHz eliminating the IF-to-RF up-conversion stage and LO generation. This simplifies the overall RF signal chain and lowering overall system cost. The AD9172 maintains superior linearity and noise performance across these RF frequencies providing system architects with the highest level of configurability. Independent numerically controlled oscillator (NCO), digital gain control, and various interpolation filter combinations per input channel provide designers with a rich suite of signal processing options to allow flexible signal chain partitioning between the analog and digital domains further enabling system designers to develop software defined platforms.

AD9208 Highlights
• Wide full power bandwidth supports IF sampling of signals up to 9GHz (-3dB point)
• Up to 96-tap Programmable Finite Impulse Response (FIR) filter block that can be configured for channel equalization and/or quadrature error correction
• Four Integrated wide-band decimation filter and 48-bit NCO blocks supporting multi-band receivers
• Phase coherent fast NCO switching enabled through GPIO pins
• JESD204B (Subclass 1) coded serial digital outputs: Support for lane rates up to 16Gbps/lane
• On-chip temperature diode for improved system thermal management

AD9172 Highlights
• Supports single-band and multi-band wireless applications with 3 bypassable complex data input channels per RF DAC at a max complex input data rate of 1.5 GSPS. 1 independent NCO per input channel
• Selectable interpolation filters provides up to 8x configurable data channel interpolation and up to 12x configurable final interpolation to support a complete set of input data rates
• Final 48-bit NCO that operates at the DAC rate to support frequency synthesis up to 6GHz
• Flexible 8-lane 15 Gbps JESD204B (subclass 0 and1) interface that also supports 12-bit high density mode for increased data throughput
• High performance, low noise on-chip phase-locked loop (PLL) clock multiplier supports 12 GSPS DAC update rate and provides an observation ADC clock driver with selectable divide ratios

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The product is a module that supports 8 electrode and multi frequency body composition analysis functions, including an analog front-end chip that supports 8 electrodes and multi frequency bio-impedance measurements and a matching analysis algorithm, which provides twenty-four human parameters, including body fat rate, muscle rate, water rate, visceral fat grade, basal metabolic rate and so on. The parameters can be applied to family health monitoring, so that people can easily grasp the composition of their own body, improve the efficiency of weight loss, fitness and health promotion, and can also be used in body building center, school, physical examination center and other institutions for human body composition analysis, auxiliary obesity diagnosis and so on.

The product includes a self-developed 8 electrode multi frequency human impedance measurement chip, combined with the self-developed human body component analysis algorithm, and integrated into a module form to improve the integration and reliability of the product, greatly reducing the difficulty of the development of the downstream manufacturers. the measurement accuracy and the range of parameters are greatly improved compared to common used body scale with 4 pole and single frequency, and which is close to the professional body composition analyzer, while the cost is significantly lower than the professional body composition analyzer, which can cover the home application scene.

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The AD9375 highly integrated wideband RF transceiver, the newest addition to ADI’s RadioVerse™ technology and design ecosystem, is the first RF transceiver to incorporate the digital pre-distortion (DPD) algorithm on-chip, which simplifies and accelerates radio development for wireless carriers and telecommunications equipment manufacturers as they transition their cellular base stations from 4G to 5G networks.

The AD9375 a design breakthrough that reduces DPD power consumption by 90 percent compared to competing solutions. The re-partitioning of the DPD system from the FPGA to the transceiver cuts the number of JESD204B serial data interface lanes in half, resulting in a dramatic power savings particularly as the number of antennas per base station increases from two to 128 in support of Pre-5G massive MIMO radio-channel density requirements. Other benefits include a more compact radio circuit layout, which simplifies routing and system design, reduces base station size, and allows designers to use a lower-cost, less complex FGPA. In small cells these benefits allow more frequency bands per cell for increased network capacity, while minimizing the impact to system power consumption and size.

The AD9375 allows customers to quickly evaluate and develop radio designs for 4G small cell and Pre-5G massive MIMO systems, key building blocks in the transition to 5G, enabling faster data rates while improving connectivity and data throughput in densely populated, high-traffic areas such as office buildings, sport stadiums and public transit systems.

The AD9375 transceiver enables a common radio platform design that is tunable over a range of 300 MHz to 6 GHz, operates on a 6-Gbps JESD204B interface and consumes less than 5 Watts. Similar to the award-winning AD9371, the AD9375 has two 100-MHz receivers, two 250-MHz transmitters, a two-input observation receiver and a three-input sniffer receiver. The transceiver’s integrated DPD solution supports 3G and 4G waveforms with an instantaneous signal bandwidth of up to 40 MHz.

• Dual differential Tx
• Dual differential Rx
• Observation receiver with 2 inputs
• Fully integrated, ultralow power DPD actuator and adaptation engine for PA linearization
• Sniffer receiver with 3 inputs
• Tunable range: 300 MHz to 6000 MHz
• Linearization signal BW to 40 MHz
• Tx synthesis BW to 250 MHz
• Rx BW: 8 MHz to 100 MHz
• Supports FDD and TDD operation
• Fully integrated independent fractional-N RF synthesizers for Tx, Rx, ORx, and clock generation
• JESD204B digital interface

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DA14586 is one of the first Bluetooth® 5 qualified SoCs. As part of the Dialog SmartBond family, the DA14586 is the smallest, lowest power and most integrated Bluetooth® solution available. It supports all Bluetooth developments up to and including Bluetooth 5 and Bluetooth low energy Mesh.
Applications
■ Remote controls
■ Proximity tags and trackers
■ Beacons
■ Connected medical devices
■ Smart home
■ Human Interface Devices
■ VR controllers
■ Connected sensors
■ Wireless charging
SoC Features
• Complies with Bluetooth 5.0, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC CFR47
Part 15 (US) and ARIB STD-T66 (Japan)
• Supports up to 8 Bluetooth LE connections
• Fast cold boot in less than 50 ms
• Processing units
- 16 MHz 32 bit ARM Cortex-M0 with SWD interface
- Dedicated Link Layer Processor
- AES-128 bit encryption Processor
• Memories
- 2 Mb FLASH memory
- 64 kB One-Time-Programmable (OTP) memory
- 96 kB Data/Retention SRAM
- 128 kB ROM Operating System and protocol stack
• Power management
- Integrated Buck DCDC converter
- P0, P1, P2 and P3 ports with 3.3 V tolerance
- Easy decoupling of only 4 supply pins
- Supports coin and alkaline battery cells
- 1.8 V cold boot support-buck mode
- 10-bit ADC for battery voltage measurement
• Digital controlled oscillators
- 16 MHz crystal (±20 ppm max) and RC oscillator
- 32 kHz crystal (±50 ppm)
- RCX oscillator(±500 ppm max)
• Flexible Reset Circuitry
- System & Power On Reset in a single pin
• General purpose, Capture and Sleep timers
- Digital interfaces
- Gen. purpose I/Os: 24 (QFN40)
- 2 UARTs with hardware flow control maximum data rate 1.0 Mbps
- SPI+™ interface
- I²C bus at 100 kHz, 400 kHz
- 3-axes capable Quadrature Decoder
• Analog interfaces
- 4-channel 10-bit ADC
• Radio transceiver
- Fully integrated 2.4 GHz CMOS transceiver
- Single wire antenna: no RF matching or RX/TX switching required
- Current consumption with supply voltage equal 3 V:
▪ TX: 3.4 mA, RX: 3.7 mA (with ideal DC-DC)
- +0 dBm transmit output power
- -20 dBm output power in ‘Near Field Mode’
- -93 dBm receiver sensitivity
Packages:
- QFN 40 pins, 5 mm x 5 mm x 0.9 mm

DA14586 is one of the first Bluetooth® 5 qualified SoCs. As part of the Dialog SmartBond family, the DA14586 is the smallest, lowest power and most integrated Bluetooth® solution available. It supports all Bluetooth developments up to and including Bluetooth 5 and Bluetooth low energy Mesh.
Derived from the SmartBond™ DA14580, which has proven to be the smallest, highest integrated and lowest power Bluetooth SoC in mass production over the past three years, the DA14586 maintains this leading flagship position for these benchmark metrics, offering even greater flexibility to create more advanced applications with the smallest footprints and power budgets. Other enhancements include an advanced power management setup with both buck and boost converters, which enable support of most primary cell battery types.
Plus, with 2 Mb of Flash memory and 96 kB of RAM, the DA14586 has double the memory for user applications of its predecessor, making it ideal for adding Bluetooth low energy to proximity tags, beacons, connected medical devices and smart home applications. Meanwhile, an integrated microphone interface reduces the system cost of voice-command remote controls, a fast growing emerging market.
Like all Dialog SmartBond solutions, DA14586 is easy to design-in and supports fully-hosted applications. The SoC is supported by a complete development environment and Dialog’s SmartSnippets™ software to help engineers optimize software for power consumption. For cost-sensitive applications, the SmartBond family will also include the DA14585 with integrated One-Time Programmable (OTP) memory as an alternative to flash memory.

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Modern wireless networks are being subjected to ever-increasing congestion levels, with the number of devices connecting up to access points rising dramatically, escalating demand for HD video streaming, greater social media activity and the growing popularity of numerous cloud-based services. In order to combat the congestion issue, Marvell introduced a family of system-on-chip (SoC) devices supporting the higher performance and more spectrally efficient 802.11ax Wi-Fi protocol towards the end of 2017. These products are capable of delivering multi-gigabit peak speeds in both directions (uplink and downlink).

Initially made up of 3 ICs, Marvell’s 802.11ax family features the following devices.
- The 5GHz frequency band 88W9068, which has 8-spatial streams and offers 8x8 multi-user MIMO operation.
- The 88W9064, which covers both 5GHz and 2.4GHz frequency bands, and has 4-spatial streams and a 4x4 multi-user MIMO configuration. - The entry-level 2x4 stream 88W9064S with 5GHz and 2.4GHz support.
The 88W9068 is aimed at addressing premium bracket enterprise and retail access points, as well as carrier-class gateway and fixed wireless service applications, while the 88W9064 is aimed at medium range enterprise and retail access points. Key targets for the 88W9064S are the service provider and over-the-top (OTT) set-top box markets.
Following on from the successful release of these 3 ICs, Marvell has now announced the 88Q9098x - which is an is AEC-Q100 grade 2 compliant combo IC with 2x2 plus 2x2 concurrent dual Wi-F 802.11ax and 802.11p functionality that is optimized specifically for automotive implementation. Among the primary applications for this will be in-vehicle infotainment systems (IVI) and facilitating over-the-air updates. The advanced 802.11ax capabilities of the 88W9064, 88W9064S and 88Q9098x are complemented by built-in Bluetooth 5/Bluetooth Low Energy (BLE) functionality.

Marvell was the first semiconductor vendor to bring an 802.11ax portfolio to market that has full multi-user MIMO and orthogonal frequency-division multiple access (OFDMA) on both the uplink and the downlink. This means that these ICs are able to address the radical changes that are currently happening to user behavior and the related data traffic patterns being witnessed - with much greater emphasis being placed on to the what is now occurring on the uplink (as well as the downlink capacity).

They enable support for a large number of simultaneous high data rate, low latency connections, with up to 16 stations via OFDMA. 1024 state quadrature amplitude modulation (QAM) encoding has been incorporated into each of these devices, so that more data can be transferred per packet. The both 88W9068 and 88W9064 have precision location functionality (with Wi-Fi angle-of-arrival and Bluetooth high accuracy indoor positioning). This means that the position of objects can be pinpointed to within a 1m margin, thereby permitting value-added location based services to be benefitted from.

The 88W9068, 88W9064 and 88Q9098x all feature, off-channel dynamic frequency selection (O-DFS) for radar detection. This allows transmission to be moved to a different channel instantaneously if a radar signal is detected on the operating channel, without any interruption to the flow of data traffic being experienced.

By presenting the industry with the most comprehensive 802.11ax portfolio to date, Marvell is making it possible for OEM customers to follow a platform design approach, where additional features and functionality can be added to the core design simply by specifying a different member of the IC family. With significant design activity already underway, this family is helping to redefine wireless connectivity and will give users reliable, secure, high performance connectivity at their homes, in their work places and even in their cars.

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Silicon Labs’ EFR32xG13 Wireless Gecko system-on-chip (SoC) portfolio is the most versatile, feature-rich wireless IoT platform available today, providing best-in-class multiprotocol connectivity and design flexibility supporting leading wireless standards and proprietary protocols. Designed to simplify the development of IoT end-node applications, Wireless Gecko SoCs deliver high performance and secure connectivity while enabling long battery life. The low-power, feature-rich SoCs and accompanying SDKs and tools meet the demands of IoT systems such as lighting, metering, security systems, home and building automation, asset tracking and portable medical/fitness equipment.

The EFR32xG13 Wireless Gecko SoCs address the needs of real-world IoT applications by supporting an array of leading wireless protocols including Thread and Zigbee for mesh networks, Bluetooth Low Energy and Bluetooth mesh, and a wide range of proprietary stacks in the sub-GHz band, as well as multiprotocol combinations of these wireless options.
The EFR32xG12 SoCs offer the highest output power (up to +19 dBm) in the multiprotocol SoC market, reducing cost and complexity by eliminating the need for an external power amplifier. Based on a low-power ARM Cortex-M4 processor core, Silicon Labs’ Gecko technology provides well-architected energy modes with ultra-fast wake-up and sleep transitions, a Peripheral Reflex System enabling autonomous operation of peripherals while the MCU sleeps, and scalable memory (up to 1MB flash and 256 kB RAM). Larger memory options make it easier to develop feature-rich IoT applications supporting multiple protocol stacks, an RTOS such as Micrium OS, backup images for devices, and over-the-air (OTA) updates for field upgrades to extend IoT product life.

To help secure the IoT, the EFR32xG13 SoCs include an on-chip security accelerator dedicated to the multiprotocol radio and a NIST-certified true random number generator (TRNG). This additional hardware cryptography block runs the latest security algorithms with higher performance and lower power than conventional software implementations.
The EFR32xG13 Wireless Gecko SoC portfolio makes it easier for developers to add versatile multiprotocol and multiband switching capabilities to complex IoT applications. The highly integrated EFR32xG13 SoCs deliver superior RF performance, enhanced cryptography acceleration, large memory options, and additional low-power peripherals and sensor interfaces.

Providing multiprotocol connectivity on a single chip reduces design costs, simplifies software development, improves life-cycle management and accelerates time to market. The SoCs enable advanced IoT functionality without incurring the additional complexity and hardware cost of a two-chip architecture, reducing the wireless BOM cost and size by up to 40 percent.

Silicon Labs has optimized the portfolio’s wireless stack architecture to enable efficient dynamic switching between different network protocols. EFR32xG13 SoCs support Zigbee and Thread mesh networking, Bluetooth Low Energy and proprietary wireless protocols. Device makers can now use a single chip to commission and configure devices over Bluetooth with a smartphone, and then join a Zigbee/Thread mesh network with dozens or hundreds of nodes or connect to devices running proprietary wireless stacks in the sub-GHz band.

The Wireless Gecko portfolio offers developers exceptional design flexibility with pin-compatible options that scale memory, peripherals and connectivity to match unique application needs. Valuable software can be reused across the entire portfolio, with pin-compatible devices scaling up to 2 MB of flash and multiple transceiver options and RF output power levels. Developers can also take advantage of certified Wireless Gecko modules with integrated antennas, including the world’s smallest system-in-package (SiP) modules, to accelerate product design, get to market faster and then later reuse software on SoCs as the business grows.

Silicon Labs’ rich toolset enables developers to optimize Wireless Gecko-based designs with application configuration, energy profiling, advanced debug and network analysis tools. Micrium OS and robust SDKs spanning wireless communication protocols and peripheral drivers further simplify IoT development.

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RSL10 is a Bluetooth 5 certified multi-protocol radio System on Chip (SoC).

Offering the industry’s lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW), RSL10 helps provide devices with advanced wireless features while optimizing system size and battery life.

Unlike most other multi-protocol radio SoCs, RSL10 is specifically designed for applications using 1.2 and 1.5 V batteries, and supports a voltage supply range between 1.1 and 3.3 V without a required DC-DC converter. The highly-integrated radio SoC features a dual-core architecture and a 2.4 GHz transceiver, providing the flexibility to support Bluetooth low energy technology and 2.4 GHz proprietary or custom protocols. RSL10 also supports Firmware Over The Air (FOTA). RSL10 is offered in a 5.50 mm2 WLCSP and 6 x 6 mm QFN. It can also easily be integrated into System-in-Package (SiP) solutions for further miniaturization.

Applications:
• IoT Edge-Node Applications
• Wearables
• Energy Harvesting

Special Features:
• Industry’s lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW)
• Industry's best EEMBC® ULPMark™ scores （1090 ULPMark CP @ 3 V; 1260 @ 2.1 V）
• Advanced Multi-Protocol Wireless Functionality: Supports Bluetooth low energy and 2.4 GHz proprietary/custom protocols
• Supports devices using 1.2 and 1.5 V batteries without a required external DC-DC converter
• Sophisticated Dual-Core Architecture
• Ultra-Miniature

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The information above was provided by the nominee and does not represent the organizer's views

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The AWA-0134 is a 28 GHz, 256-element, reconfigurable active electronically scanned antenna for 5G mm-wave communication applications. The array is based on Anokiwave’s AWMF-0108 28 GHz 5G Quad Core IC and allows for real-time active beam-steering applications in a single 256-element or in a 4x64 element configuration that enables 4x4 MIMO testing. It is developed using planar antenna technology resulting in a very low profile, lightweight unit. The array features full flexibility in the choice of waveform stimulus and timing-control and is another enabling technology product for the evaluation and development of 5G networks. Potential applications include rapid prototyping and testing of electronically beam-steered radio links through low-latency beam update rates that meet the 5G requirements for sub-symbol interval update rates, mmWave 5G propagation testing, and 5G mmWave OTA testing.

The AWA-0134 represents the first commercially available 256-element phased-array at 28 GHz to enable the development and measurement of radio links and channel models, as well as for rapid prototyping and testing of electronically beam-steered radio links through low-latency beam update rates. The array demonstrates the performance achievable using low power silicon integration and efficient antenna layout and design. Using the AWMF-0108, the antenna provides +60 dBmi (1000 W) of EIRP and a G/T of greater than ‐2 dB/K at boresight, or an effective NF for the receive chain of approximately 5dB. The electronic 2D beam steering is achieved using analog RF beam forming, with independent phase and gain control in both Tx and Rx operating modes. A two-dimensional conical scan volume of ±60 degrees in both azimuth and elevation is supported. As this is a time-division duplex (TDD) system, the array operates in a half-duplex mode, enabling the same antenna to support both transmit and receive, with distinct transmit and receive beam settings if required. A weather sealed mechanical design allows for outdoor deployment.

The AWA-0134 antenna leads the way in showing how 5G coverage can be rolled out by network operators using the mmWave bands, with low power footprint and high energy efficiency, while meeting key operating specifications for data rate, latency, coverage and reliability.

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The Intelligent Gain BlockTM (IGB) ICs (AWMF-0116, AWMF-0117, AWMF-0141, and AWMF-0143) are a family of four, single-channel, Ku- and Ka-Band silicon ICs offering complete transmit/receive functionality, including active gain and phase control. The architecture enables the ICs to be used as traditional gain blocks with the addition of gain and phase control, temperature telemetry and digital functions—hence the name “Intelligent Gain Blocks” (IGB). This new family enables designers to use the same IC for multiple functions across the RF signal chain, achieving equivalent or better performance than traditional, discrete GaAs ICs and with increased software control. The versatile IC family can be used in a wide range of applications, including SATCOM, RADAR, 5G and sensing. The integration and small size allow the ICs to be used in RADAR or communications phased arrays, as well as replacing discrete, single function blocks.

Each IC in the family contains a PA, LNA, 6-bit gain and phase control; two of the ICs—one in each band—have an integrated T/R switch at the front-end. The two other ICs eliminate the T/R front-end switch, offering users the option to eliminate the switch loss. Taking advantage of the highly integrated IC process, the IGB can replace multiple RF functions with a single, small IC that meet or exceed the performance of many traditional GaAs products. One IGB IC can replace seven, separate GaAs components with a single 2.5 mm x 2.5 mm IC, without compromising performance. These IGBs can be used for diverse applications, such as:
-Core Distribution IC in 5G and SATCOM all silicon active antenna arrays
-Integrated blocks for column fed 5G architectures
-Single function blocks – Low Noise Amplifier w/ or w/o switch, Driver Amplifier w/ or w/o switch, Variable Gain Amplifier, Phase Modulator, or Vector modulator.

The new Intelligent Gain BlockTM IC family will re-define Ku- and Ka-Band designs; with this new product family, designers can now use the same IC for multiple functions across the RF signal chain, have increased control using a software interface, and provide equivalent or better performance than traditional discrete GaAs ICs. The ICs are a versatile new intelligent gain block of the microwave and millimeter-wave world.

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WS9638B is single chip Bluetooth SOC for applications including high end Bluetooth speaker, smart speaker, high end Bluetooth headset, smart headset, wireless or wired sound bars, etc.

Main features:
 Bluetooth audio SOC with transceivers, baseband, modem, processors, SRAM, via ROM, internal flash and external flash controller, audio CODEC, and power management integrated in the same chip.

 Excellent class 1 RF performance in transmission power , receiver sensitivity, and anti-interference characteristics.

 Heterogeneous multi-core design with one processor for running high level application, one processor for running Bluetooth stack, and one two-way VLIW DSP for running complicated audio enhancement and other computing intensive algorithms.

 Execution from flash to enable customer developing their own wireless audio transmission and audio processing applications on cell phone accessories。

 Rich interfaces for complex applications and UI.

Brief spec:
 RF: 10dB TX power, -93dB sensitivity.
 Audio: 24bit/192Khz audio codec with 110dB SNR, 95dB THD.
 SW: customer can port their own applications/algorithms on top of RTOS.
 Interface: IIS/IIC/USB/SD/UART/SPI/LCD.
 Multi power domain.
 Excellent class 1 RF performance, accepted by first tier oversea customers  Innovative source and channel coding with error correction algorithms, achieving 50% more transmit distance compared to the products with the same Tx power and Rx sensitivity.

 Modular software architecture, flexible for customers’further software development.  Dual MAC 24 bit Audio DSP, capable running various voice trigger, noise cancellation, echo cancellation, low bit rate audio codec, and deep learning algorithms.

 24 bit/192Khz ADC for professional audio performance.

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The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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SEED-SSAC_A10 is a PCIe x8 card based on the high-bandwidth, power-efficient Intel PSG Arria 10 GX FPGA. Designed for high-end applications, The Arria 10 boasts high densities and a power-efficient FPGA fabric married with a rich feature set including high-speed transceivers up to 28 Gbps, hard floating-point DSP blocks, and embedded Gen3 PCIe x8. The board offers two DDR4 memory sockets supporting up to 16 GBytes of memory each, and sophisticated clocking and timing options, and two front panel QSFP cages, each supporting up to 40 Gbps. The FPGA supports Gen3 PCIe x8 via hard IP blocks and provides up to 1150K equivalent Les, The QSFP SerDes channels are connected directly to the Arria 10 FPGA, thus removing the latency of external PHYs. The QSFP cages can optionally be adapted for SFP+. The SEED-SSAC_A10 also incorporates a MAX10 CPLD for Flash loader and FPGA configuration. The SEED-SSAC_A10 can be implemented in many market segments such as big data analytics, artificial intelligence, genomics, video transcoding, financial trading, et cetera. Specification：

 Intel PSG Arria 10 GX FPGA：10AX115H3F34E2SG
 Intel PSG Max 10 CPLD: 10M02SCU169C8G
 Flash：128MB x2
 Memory : 16 Gbytes DDR4 DIMM(x72 with ECC)x2
 PCIe x8 interfaces supporting Gen1, Gen2, or Gen3
 Two QSFP cages support 2x 40GbE or 8x 10GbE
 FPGA debug interface： JTAG
 Power supplied by PCIe interface
 Low profile (Half-height, half-length: 168mm x 68.9mm) PCIe one slot card
• Power supplied by PCIe interface
• Low profile (Half-height, half-length: 168mm x 68.9mm) PCIe one slot card
Complex data-intensive applications in the areas of genomics, finance, industry 4.0 and other disciplines are pushing the boundaries of data center capabilities.
The traditional solution use CPU and GPU as the processor which both are Von Neumann architecture, which will consume more power to complete the same task comparing with FPGA. And of CPU and GPU.User cannot change the hardware architecture, which will reduce the system flexibility.

The SEED-SSAC_A10 use FPGA as it’s processor to massively parallelized hardware offloading to maximize performance and power efficiency of the system, for the FPGA is field programmable and user can modify the program architecture at any time. And the SEED-SSAC_A10 provide developers with the ability to harness the power of acceleration card with an unprecedented productivity to match the growing demands on field. The FPGA can be reprogrammed in a fraction of a second which will exactly match customer’s key algorithms’ demands. With this advantage, original equipment manufacturers can upgrade their acceleration solutions by letting SEED-SSAC_A10 collaborate with the traditional device like CPU or GPU. This will offer more flexible acceleration solutions to their customer with their unique value add.

With this collaboration, customer can deal with their workload more efficient and sometimes lower latency which will provides a new technology capability for customers to unlock their business potential.

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Qormino™ is an ultra-compact, 64-bit multi-core, NXP processor based module integrating DDR SDRAMs for high performance, communication intensive applications. Designed to aid fast time to market, it solves the thorny problem of premature product obsolescence. Thankfully, Qormino™ is supplied from e2v’s SLiM™ expert inventory management program, offering prolonged supply up to 15 years. Embedded designs based on Qormino™ are guaranteed an extended time-in-market. The QT1040-4GB is implementing the T1040 QorIQ processor from NXP and a 4GB DDR4 memory. This combination provides the benefit of the T1040, a high performance networking processor in a module integrating high density DDR4 memory. The CPU offer four PowerPC cores at up to 1.4GHz and an extensive set of I/O including, among others, eight high-speed 5Gbps capable SERDES, two modern QSGMII interfaces, up to six SGMII interfaces supporting 1000Mbps and 8 ports gigabit Ethernet switches.

The DDR4 memory on the other hand offer high-sensitivity with 4GB and Error Coding Correction (ECC) and run at up to 1600MT/s in the QT1040-4GB product.

The QT1040-4GB is supplied in a 44x36mm package in commercial, industrial, automotive and military temperature grade.

The time-to-market, risk reduction and small size make the QT1040-4GB a fitting solution in particular for embedding systems such as many types of avionics flight computers. The Qormino solution provides time-to-market benefit as it solves the thorny issue of interfacing and testing the interface between high-speed DDR memory and CPU. Qormino™ is supplied from e2v’s SLiM™ expert inventory management program, offering prolonged supply up to 15 years

In addition, Teledyne e2v supply this product through its Semiconductor Lifecycle Management (SLiM) solution solving the problem of premature product obsolescence.

QorminoTM includes an innovative hardware acceleration technology known as data path acceleration architecture (DPAA) which schedules computational work to specific cores (both physical and virtual). This complex control mechanism maintains data flows across the processor, ensures data buffers are properly pre-loaded and avoids data congestion.

AltiVec technology that boosts signal processing performance is also present. AltiVec is a group of single instruction, multiple data (SIMD) instructions designed to boost processing in parallel systems.

The same powerful communication features that make QorIQTM processors a popular choice for enterprise infrastructure ensures there’s no shortage of built-in interface options for military systems. QorminoTM supports high data bandwidths and simplifies connection both to system backplanes and high performance peripherals.

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The Journey 1.0 chip was released in December 2017 along with the Sunrise 1.0 chip. It became the first Chinese AI processor to be mass produced. Journey 1.0 is able to precisely process and distinguish the targets including pedestrians, motor vehicles, non-motored vehicles, traffic lanes, street signs, traffic lights, etc. It could also support the high performance level 2 Advanced Driving Assistant System (ADAS).

The Sunrise 1.0 chip was released in December 2017 along with the Journey 1.0 chip. It became the first Chinese AI processor to be mass produced. The Sunrise 1.0 chip utilizes world leading deep learning algorithms, equipped with the ability to conduct large-scale facial recognition, tracking and real-time footage analysis for Smart City and Smart Retail.

1080p @ 30fps Efficient object detection: 200 objects per frame Low latency: 30ms Low energy consumption: typical power 1.5W

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The AL462 UHD FIFO provides the world’s largest and fastest First-In-First-Out (FIFO) data queuing memory used by wide-range 4K2K Ultra HD video/audio applications in Broadcast, Video Surveillance, Medical, Camera Image Processing and Industrial Instrument markets.

The AL462 consists of 512Mbits memory size and can be configured as a 16Mx32-bit or 16Mx16-bitx2 bus interface and operated at maximum R/W speeds up to 150 MHz; equivalent to 9.6GB/sec of simultaneous read/write data throughput.

The AL462 UHD FIFO provides easy-to-use I/O interfaces and controls for FPGA designs, such as selectable control signal polarity, two frame buffer modes, facilitating usage in multimedia systems, video capture systems and various video data buffering applications.

Manufactured using state-of-the-art technologies and available as a 249-ball LFBGA package, allow product designers to keep power consumption and real estate to a minimum.

The AL462 has a Development Kit for ALTERA HSMC Platform. It is a reliable partner for engineers who design Video Editing, Video Algorithm, and Video Pattern Generator applications. When engineers want to develop related products on FPGA platform, they can use the AL462 FIFO module to capture and store image data independently. From now, engineers can use image data at any time without worrying about the bandwidth and the capacity of FPGA and DDR memory will be limited by additional image processing tasks.

The AL462 Development Kit includes a standard HSMC interface module for ALTERA FPGA platform, and it also provides Verilog sample code/project code for Cyclone V GX Starter Kit. When engineers integrate the code into their FPGA code, the AL462 FIFO will manage the image buffering task and the FPGA and DDR memory will become more efficient in their algorithm.

With the AL462 FIFO memory IC and Development Kit, product developers can immediately evaluate and develop their own company's products, and do not need to study how to control the video memory circuit. Using the AL462 greatly reduces product evaluation and development time.

AL462 FIFO Advantages
Extremely simple design interface
 Supports HD video application up to 4K2K Ultra HD resolution
 Reduces design/development efforts
 Reduces overall costs
 Faster time to market
 Improves system performance
 Easy retrofit for existing designs
 Supports varieties of Hi-Speed applications

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Why vote for us

The Optical Transport Network (OTN) defined in ITU-T G.709 is the default protocol that underpins today’s DWDM packet optical transport networks. Two generations of OTN have already been widely deployed: OTN1.0, which was based on 10G WDM transport; and OTN2.0, which enabled the transition to 100G metro OTN switched networks and is the de facto standard in networks today. OTN has proven to be extremely flexible for accommodating new client signals and line rates. However, the transition to next generation OTN transport has needed to account for greater network densification and flexibility. OTN3.0 responds to this by introducing flexible, “beyond 100G” (B100G) optical transport, coupled with support for new services like 25GE, 50GE, 200GE, 400GE, and Flexible Ethernet. While there will be an enduring market need for OTN2.0, with network traffic destined to undergo another wave of growth, optical transport networks will soon be adding OTN3.0. Microsemi's OTN processors lead in innovation, integration, and power, delivering the quickest time-to-market and lowest R&D expense for the original equipment manufacturer and minimizing total cost of ownership for the service provider.

DIGI-G5
Built for the cloud and 5G data transport era, DIGI-G5 is Microsemi’s newest addition to the award-winning DIGI franchise. DIGI-G5 enables packet optical transport platforms to triple in capacity while slashing power consumption by 50 percent per port. DIGI-G5 delivers an unprecedented 1.2 terabits per second of combined OTN, and client interfaces supporting 10GE, 25GE, 50GE, 200GE, 400GE, Flexible Ethernet (FlexE), and Flexible OTN (FlexO). DIGI-G5 provides dense “Beyond 100G” (B100G) OTN transport support for cloud-scale 100G+ P-OTPs, DWDM, data center interconnect (DCI), and mobile fronthaul.

Microsemi's DIGI-G5 offers differentiating features and innovations to support the 5G era:
• New OTN 3.0 rates, enabling flexible (FlexO) and fractional 100G+ transmission
• Comprehensive Ethernet support including 25GE, 50GE and 100GbE
• Close to 1 microsecond datapath latency
• Supports hard traffic isolation and slicing over OTN
• High precision nanosecond level IEEE 1588 PTP timestamping accuracy
• Integrated G.HAO bandwidth-on-demand processing for OTN switching networks closer to the access

5G wireless use cases will impose new requirements like network slicing, stringent latency and timing synchronization on the underlying optical transport networks. With 25G, 50G and 100Gbps port rates planned for 5G remote radio heads, the traffic flow from the radio to the mobile edge will dramatically increase. With the promise of up to 50x lower end-to-end latency, the optical transport network will play a critical role in enabling ultrareliable low latency communication (uRLLC) applications such as autonomous vehicles. New architectures leveraging hard traffic isolation will further enhance the business opportunities network slicing is set to bring for mobile operators.

Microsemi recently announced its collaboration with China Telecom Beijing Research Institute to define and develop next-generation optical transport solutions to meet the stringent requirements of 5G.

“China Telecom plans to be the pioneer in both 5G commercial service and 400G OTN network commercial deployments. A mobile-optimized converged metro, multiservice and cloud-based OTN transport network is critical to both initiatives," said Zhang Chengliang, vice president, China Telecom Beijing Research Institute. "The availability of Microsemi's DIGI-G5 will help the industry deliver a new generation of OTN equipment to enable the 5G era."

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

Why vote for us

Enabling wireless connectivity in hearing aids and cochlear implants, Ezairo® 7150 SL is an open-programmable Digital Signal Processor（DSP）- based hybrid module that supports Bluetooth® low energy technology and other 2.4 GHz wireless protocols.
Ezairo 7150 SL includes:
• Ezairo 7100 DSP: Includes a high precision, quad-core architecture that delivers 375 MIPS without sacrificing power consumption.
• Radio IC: Powerful wireless transceiver to support Bluetooth low energy technology and proprietary 2.4 GHz protocols
• EA2M: 2 Mb EEPROM memory for storing important hearing aid parameters and firmware
Development Tools:
• Ezairo Preconfigured Suite, including wireless-enabled firmware with adaptive audio algorithms, development software and cross-platform software development kit (SDK)
• Open-Programmable Evaluation & Development Kit (EDK)
Key Features:
• Advanced Wireless Functionality: Supports Stereo Audio Streaming, Control Over Bluetooth Low Energy (CoBLE). Wirelessly control hearing aid features from smartphones, and stream audio from external sources (e.g., smartphones, televisions) through a remote dongle. • Ultra-Low Power Consumption
• Ultra-Miniature: Integrates Ezairo 7100 DSP, radio IC, 2 Mb EEPROM memory, and necessary passive components into one single hybrid module to minimize overall system size.
• Flexible Programmability
• Ultra-High Audio Fidelity
• Configurable System Clock Speeds
• Low Audio Delay
Application:
• Wireless Connectivity
• Audio Processing
• Stereo Audio Streaming
• Control Over Bluetooth Low Energy
End Products:
• Hearing Aids
• Cochlear Implants
Special Features:
• Industry’s first most integrated, flexible, and power efficient, mixed-signal DSP solution.
• Ultra-Low Power Consumption
• Ultra-Miniature: Integrates an audio DSP, EEPROM memory and a radio IC into one single hybrid module to minimize overall system size. Its system-level package (SIP) help hearing aid manufacturers overcome the space constraints of small devices
• Providing multi-protocol wireless support, and enable two advanced wireless features:
1）It enables communications between the hearing aids and any Bluetooth device. Users can control over BLE. This includes everything from phone alerts for volume control, program change, incoming calls or text messages, battery monitoring etc. 2）Using a 2.4 GHz-based proprietary protocol, which supports stream stereo audio from external sources (e.g., smartphones, televisions) through a remote dongle.

• Ezairo 7150 SL is the first hybrid module to be supported by the Ezairo Pre Suite. The Ezairo Pre Suite represents a serious leap forward in supporting hearing aid development. It provides manufacturers with a complete easy-to-use, turnkey solution with all components needed to create a hearing aid or OTC device. The mobile SDK is a compelling addition to the software, enabling the creation of new and exciting ways for users to interact with their hearing devices from their smartphones

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AndesCore™ NX25 is a compact 64-bit CPU IP core tailored for high-performance embedded control which needs to access over 4GB address space. It is based on AndeStar™ V5m architecture, the very first mainstream ISA that offers RISC-V technology. It comes with options, including branch prediction for efficient branch execution, Instruction and Data caches, Local Memories for low-latency accesses, and ECC for L1 memory soft error protection.

NX25’s 5-stage pipeline is optimized for high operating frequency and small gate count. Features available to address wide variety of design requirements include PLIC and vectored interrupts for serving various types of system events, AXI or AHB 64-bit data bus for addressing up to 64-bit address, PowerBrake and WFI mode for low power and power management, and JTAG debug interface for development support.

NX25 is perfect for various applications, including large-scale network controllers, high capacity storage devices, data analytic accelerators, computer vision and pattern recognition, artificial intelligence to deep learning and so on.

Performance
 AndeStar™ V5m Instruction Set Architecture (ISA), compliant to RISC-V technology
 Andes extensions, architected for performance and functionality enhancements
 64-bit CPU architecture, enabling software to utilize the memory spaces far beyond 4G bytes imposed by 32-bit CPUs
 16/32-bit mixable instruction format for compacting code density
 Branch predication to speed up control code
 Return Address Stack (RAS) to speed up procedure returns
 Flexibly configurable Platform-Level Interrupt Controller (PLIC) for supporting wide range of system event scenarios
 Enhancement of vectored interrupt handling for real-time performance
 Advanced CoDense™ technology to reduce program code size

Flexibility
 Easy arrangement of preemptive interrupts
 StackSafe™ hardware to help measuring stack size, and detecting runtime overflow/underflow
 ECC or Parity check on level-one memories for fault protection
 Several configurations to tradeoff between core size and performance requirements

Power Management
 PowerBrake technology to reduce peak power consumption from within the CPU
 WFI (Wait For Interrupt) mode to enable SoC power management

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

Why vote for us

This cutting edge device provides a 250% increase in data rate over Gigabit Ethernet, and requires no changes to existing cable infrastructure.

Realtek’s 2.5G Ethernet solution is the world’s first to adopt a QFN package without heat sink. It is also the world’s first pure ASIC solution for 2.5G Ethernet that does not require Firmware and external FLASH, which minimizes the external BOM cost. For backward compatibility with legacy devices it also supports 10/100/1000Mbps modes.

The RTL8125AG is part of the RTL8125 series and is designed for Gaming PCs. In conjunction with Realtek Dragon Software, incoming high priority packets are processed immediately, eliminating queuing delays and providing an enhanced gaming experience.

2.5G Ethernet will increase business working efficiency by increasing the network speed. It will also greatly reduce file transfer time between networked devices in a home environment, where video streaming over the network is becoming commonplace. Realtek’s single-chip 2.5G Ethernet ICs are currently the most competitive 2.5G solutions in the market

1. First to adopt a QFN package for 2.5G <= RBOM cost reduction
2. Lower power requires no heat sink <= RBOM cost reduction
3. Pure ASIC solution for 2.5G Ethernet that does not require Firmware and external FLASH <= RBOM cost reduction
4. Receive Packet Priority Interrupt feature <= enhanced gaming experience by allowing packet prioritization for both transmit and receive packets

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WT8911 Smart Camera Processor – Innovative ADAS Implementation with Edge Computing The WT8911 Smart Camera Processor for Advanced Driver Assistance Systems (ADAS) application is a compact and low energy-consuming solution ideal to be embedded in an automotive camera module.

The WT8911 is a high performance ADAS processor which incorporates a 32-bit RISC CPU with DSP instruction set that operates up to 200MHz and rich vision-processing-units/interfaces such as scaler, lens correction, image mask, LK (Lucas–Kanade) optical flow detection, FAST (Features from Accelerated Segment Test) corner detection, OpenVx engine and etc. It features key ADAS functions such as LDW (Lane-Departure Warning), MOD (Moving-Object Detection), BSD (Blind-Spot Detection), RCTA (Rear Crossing Traffic Alert), DOW (Door Open Warning) and etc.

With a small form factor BGA package (8mmx8mm), the WT8911 is perfect for smart camera for automotive application where the vision processor must be integrated into the camera module. It can also acts as a co-processor of Weltrend’s WT8893S Around View Monitor (AVM) processor providing ADAS features to an AVM system. The WT8911 has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 2).

While most ADAS processers in the market are based on a very high-end CPU with DSP running at very high frequency to have the advantages of computing power and coding flexibility, their cost, power consumption, and form factor however are not optimized. In addition to a 32-Bit RISC CPU with DSP instruction extension, the WT8911 also built-in image processing hardware accelerator, which can reduce the loading of the CPU, so the CPU can run at a relatively lower frequency to meet the low power consumption and coding flexibility criteria in the same time.

The hardware accelerator in the WT8911 is dedicated designed for image processing application related functions, such as LK (Lucas–Kanade) optical flow detection, FAST (Features from Accelerated Segment Test) corner detection, OpenVx engine and filtering masks. This innovative approach makes the WT8911 performance optimization possible in terms of power consumption, cost, and form factor.

Since the WT8911 is not using the CPU brutal force to implement the algorithms like the competitors do, instead, hardware accelerator is adopted. When compared with competitors’ chips, the WT8911’s advantages include low power consumption ( <280mW) so no heating generation/dissipation issue, quick start (<0.2s) since no operating system (O.S.) is required, built-in large SRAM so external DDR memory is not required, overall, good cost/performance can be achieved. Due to the small form factor (8mm x 8mm), the WT8911 can be included in a 20mmx20mm camera module, which makes the smart camera for edge computing possible. By integrating the WT8911 into an ordinary car camera module, it will turn the image-capture only camera into a smart camera, which can perform ADAS functions such as LDWS、BSD/RBSD、MOD/RMOD、RCTA and DOW. Because the computing is performed in the edge without sending the images to the cloud, the results can be obtained in real-time without latency, which can improve the safety of the drivers.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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JMS583 is the 1st launched bridge controller with USB 3.1 Gen2 to PCIe Gen3x2 with integrating NVMe host control feature in the world. The chip was announced to mass production in Apr, 2018, and volume delivery to the market. JMS583 can provide higher than 1000MB/s data transfer rate when equipped with PCIe/NVMe SSD. JMS583 can be easily used to multiple fields, like external SSD, CFX reader, SDE reader, and embedded system which requiring extreme data transfer rate applications.

JMS583 is the 1st launched and mass production product to ultra-high speed data transfer bridge controller with USB 3.1 Gen2 to PCIe Gen3x2 (NVMe). The data transfer rate can be reached to higher than 1000MB/s which is almost 2x higher than current USB/SATA bridge controller. JMS583 is also the 1st one, USB to PCIe/NVMe, bridge controller which can get the USB-IF certification (TID: 5,040,109,048), in Jun 2018. Compact package size (QFN 8x8) is also the smallest one comparing to foreseeing market competitors. With the smallest package form-factor, more compact ultra-high speed external storage product designs are achievable in the future.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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As the trend of modern smartphone is removing 3.5mm headphone jack and using a single USB-C connector as sole interface for wired connectivity, there is a need for cost-effective solution to provide users a method to charge the phone and to listen music at the same time. VIA Labs VL104 is exactly our response for such trend which is a highly integrated solution to enable below three applications.

1. Interchangeable charge-through USB audio dongle. VL104 integrates three USB-C Dual-Role-Power (DRP) ports. First one is to connect smartphone. The other two are either to connect USB-C power adapter to charge the phone or to connect USB-C audio to listen music. The USB-C power adapter and USB-C audio are interchangeable by first-plugin-first-serve basis for user-friendly that VL104 micro-controller determines which device is plug-in and switch built-in USB2.0 data switch accordingly to route to USB audio source from smartphone. Charging the phone and listening music at the same time on a smartphone with only USB-C connector can be easily achieved by using VL104.

2. Any port charge-through multi-function dongle. Accompanied with USB hub controller which provides USB extension port functionality, VL104 based multi-function dongle now is full-functioned. The two downstream USB-C ports can connect to one USB-C power adapter and one USB-C device. Also, it can connect to two USB-C devices due to USB hub employed. When two USB-C power adapters are plug-in, the first plug-in performs charging function. The second adapter can do charging immediately once VL104 detected first one had plug-out.

3. VL104 also integrates USB-C DisplayPort alternate mode function which can transport 4K video stream through USB-C connector to external display or TV. VL104 handshakes with smartphone supporting DP alt-mode to re-assign USB-C pin definitions to transmit 4K video stream by DisplayPort. Adding DP-to-HDMI converter then can support wildly used HDMI TV or display.

VL104 design architecture is application-oriented aimed for phone accessories to meet the evolution trend of smartphone. Compared to our competitors, VL104 provides below unique advantages.
1. Highly integrated for interchangeable charge-through audio dongle to save BOM and PCBA size. Supporting three USB-C DRP ports and built-in USB2.0 data switch enables single chip solution for charging the phone and listening music simultaneously over single USB-C host port. Our competitors need multiple chips to achieve same functionality which is not competitive for phone accessory in cost and size.
2. Supporting in-house auto standby mode to save power when connected interfaces are idle. USB-C Power Delivery (PD) specification doesn’t define power saving mode like suspend mode or standby mode. But phone accessory has very strict demand on device power consumption. Therefore, VL104 designed different power domains and using timers to automatically enter power saving mode with minimal functional blocks active when VL104 connected interfaces are in idle. The VL104 power consumption is about 1mA when auto standby enabled and about 15mA without auto standby. It’s very significant power saving, especially most of the time the interfaces connected to VL104 are in idle after interface initially handshaked.

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FT8719 is a brand new product from FocalTech which was released to the market in the second half of 2017. It is an integrated In-cell IC (IDC) of FHD built on LTPS panel. This product is designed to target the mainstream FHD market, which has received much attentions from our clients. The smartphone manufacturers, such Huawei, MI, vivo and OPPO, etc. have involved in defining product functions and supply planning of FT8719.

The current LCD solution in smartphone market is facing an all-around challenge due to the rise of OLED solution. With features such as auto-luminescence and flexibility, OLED holds multiple natural advantages in terms of structure and appearance. LCD In-cell is the best defensive strategy for LCD against OLED. Through optimizing pinout layout and building a reasonable integrated In-cell model, FT8719 helps increasing the advantage of LCD solution. Either COG or COF, by using FT8719, can make LCD solution close to OLED solution in terms of structure and appearance. Furthermore, it remedies LCD’s shortcoming and strengthens its cost advantage, and offers a strong support to LCD in market competition. If we look at the feasibility and development trend of smartphone products, it is found that LCD In-cell still enjoys relatively strong market vitality. As such, FT8719 plays an important role as a leading product fitting into the FHD In-cell solution.
The advantages of FT8719 include:
1. FT8719 has adopted the Interlace Pad design and optimized the ID design for All Screen. By using interlace design, it can reduce the height of bottom bezel in COG panel and COF panel to reach less than 3.8mm and less than 2.5mm in height respectively. It is the most advanced design that LCD panel can achieve at present. The design of Interlace Pad is currently the best option for meeting what an All Screen & Extreme Narrow Bezel design is requiring, and FT8719 takes the lead in design on this regard in FHD In-cell area.

2. FT8719 can optimize and support Notch screen design, which makes Notch design in display panel more optimized. The existing issue in uneven loading of Pure Display panel has caused display problems on both sides of Notch screen. The loading problems of In-cell are more complicated after being integrated with Touch. By leveraging its rich experiences in display panel and touch screen, FocalTech is working with display panel manufacturers to come out a new blended design for display panel driven by IC. This new design has optimized the capability of Notch and received wide recognition and strong orders from many display panel manufacturers.

3. FT8719 can be compatible to COG and COF. By combining the present production capacity and technical experiences, we make adjustments to the layout of Pad Pitch and Pad in IC to allow one unit of IC to support both COG and COF, and is mass-production ready. We are currently running projects for COG and COF simultaneously.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views点

Why vote for us

The NuMicro M480 series is a high performance and low power microcontroller with Arm Cortex-M4F. Its operation frequency is up to 192 MHz with 175µA/MHz dynamic power consumption and the standby current can be down to 1µA. M480 series provides 512 KB embedded Flash, 160 KB SRAM and 32 KB cache of external SPI Flash for speeding up eXcute-In-Place. It also supports secure boot functionality, hardware cryptography engine, USB full speed and high speed OTG with integrated PHY, 10/100 Mbps Ethernet MAC and versatile peripherals, including 1x SPI Master, 1x Quad-SPI, 4x SPI/I²S, 6x UART, 3x ISO-7816, 3x I²C, 2x USCI (configurable UART, SPI, I²C), 2x CAN, 2x SDHC, 2x QEI and 16-bit, 24-ch 192 MHz PWM. The M480 series also integrated 1x 12-bit, 16-ch 5MSPS SAR ADC, 2x 1MSPS DAC, 2x analog comparators, 3x operational amplifiers and 16-bit parallel LCD interface. Furthermore, it supports FreeRTOS, Arm Mbed OS and provides free emWin GUI library. The operating voltage is from 1.8V to 3.6V and the operating temperature is from -40°C to 105°C.

The M480 series includes six sub-series:
 M481 base series: high performance, low power with versatile peripherals, eligible for sensor hub.
 M482 USB FS OTG series: USB 2.0 full speed interface with on-chip OTG PHY, eligible for gaming accessories.
 M483 CAN series: 2 sets of CAN 2.0B interface, 2 sets of USB 2.0 interface, up to 9 sets of UART interface, eligible for IoT and industrial control.
 M484 USB HS OTG series: 2 sets of USB 2.0 interface with op-chip full speed and high speed OTG PHY, eligible for data collector.
 M485 Crypto series: hardware cryptography engine and random number generator, eligible for fingerprint module, smart meter and secure USB device.
 M487 Ethernet series: 10/100 Mbps Ethernet MAC, eligible for Ethernet converter, industrial automation and IoT gateway.

1. Up to 192 MHz core speed and 160 KB SRAM speed up algorithm computation. 2. Secure Boot functionality provides a constant digital signature of system software to protect the integrity of Flash contents.
3. Embedded hardware cryptography engine, including ECC (Eclipse Curve Cryptography), AES-256, DES, Triple DES, SHA-512 and HMAC, provides fast and easy encryption, decryption, ID certification, private key and public key features.
4. The embedded random number generator can randomly fabricate the key for data encryption/decryption and certification.
5. Hardware CRC unit can prevent system error introduced by external interference.
6. One-Time Programmable ROM can protect the encryption key from being read or alternated.
7. Supports up to six tamper detection pins to detect system status to secure data.
8. To protect customer’s intellectual property, M480 provides Flash lock, 4 KB SPROM (Secure Protection ROM), 96-bit UID (Unique Identification) and 128-bit UCID (Unique Customer Identification).
9. Embedded 512 KB Flash memory in dual bank architecture to support Over-The-Air firmware upgrade for updating system firmware in runtime.
10. 32 KB cache of external SPI Flash memory to speed up eXecute-In-Place. 11. Up to 11x UART, including 6x low power UART, 3x ISO-7816 and 2x USCI (configurable UART), supports multi-UART communication.
12. Provides high speed data conversion with 12-bit 16-ch 5MSPS SAR ADC.
13. Two USB 2.0 interfaces including integrated full speed OTG PHY and high speed OTG PHY save the external PHY cost.
14. 10/100 Mbps Ethernet MAC with industrial standard RMII interface to quickly implement the network connection.
15. Free emWin GUI library accelerates the design of human machine interface.

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The industry’s first family of Controller Area Network (CAN) transceivers including various automotive Grade 0 qualified parts is now available from Microchip Technology Inc. The ATA65XX family adds six new devices to Microchip’s CAN portfolio.

The new family supports the recently established CAN FD (Flexible Data-rate) protocol for up to five Mbit/s communication speed and the new CAN PN (Partial Networking) standard for improved energy efficiency of vehicles.

Therefore, the devices are fully compliant with the ISO 118980-2/5/6, 11898-2:2016 and the SAE J2962-2 standards. The ATA6562, ATA6563, ATA6564, ATA6565 and ATA6566 build the industry’s first automotive Grade 0 qualified CAN/CAN FD transceiver family with an ambient temperature rating of -40° to 150°C.

The family also provides a CAN partial networking transceiver including a window watchdog. All devices in the family are approved by major car manufacturers for use without the external Common Mode Choke (CMC) that is required for most CAN transceivers.

Microchip provides the new family in SO 8/14 and DFN8/14 packages with wetable flanks, ready for automatic optical solder-joint inspection.

Microchip has one of the strongest and most complete CAN portfolios in the industry, Our transceivers ensure reliable communication in the harsh automotive environment with less external components and minimal board space which leads to lower system cost.

All family members include wake-up capability via CAN bus with dual wake up pattern according to ISO11898-2:2016. A modern vehicle contains more than 70 Electronic Control Units (ECU) with CAN interface. This feature avoids unwanted power-up sequences, leading to significant energy savings and reduced emissions.

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System developers designing high-end embedded control applications can benefit from a new Digital Signal Controller (DSC) with two dsPIC DSC cores in a single chip, now available from Microchip Technology Inc. The dsPIC33CH has one core that is designed to function as a master while the other is designed as a slave. The slave core is useful for executing dedicated, time-critical control code while the master core is busy running the user interface, system monitoring and communications functions, customised for the end application. The dsPIC33CH is designed specifically to facilitate independent code development for each core by separate design teams and allows seamless integration when they are brought together in one chip.

The dsPIC33CH family is optimised for high-performance digital power, motor control and other applications requiring sophisticated algorithms. This includes applications such as wireless power, server power supplies, drones and automotive sensors. For example, in a digital power supply, the slave core manages the math-intensive algorithms, while the master core independently manages the PMBus™ protocol stack and provides system monitoring functions, increasing overall system performance and responsiveness. Distributing the overall workload across two DSC cores in a single device enables higher power density through higher switching frequencies, leading to smaller components. The dsPIC33CH family was designed for live updating of the system, which is especially important for power supplies where firmware updates must be made with zero downtime.

The dsPIC33CH is available in eight package variants from 28 to 80 pins and as small as 5 x 5 mm. Memory sizes range from 64 to 128 KB of Flash.

In an automotive fan or pump, the slave core is dedicated to managing time-critical speed and torque control while the master manages the Controller Area Network Flexible Data rate (CAN-FD) communications, system monitoring and diagnostics. The two cores work seamlessly together, enabling advanced algorithms to improve efficiency and responsiveness.

Each of the new cores in dsPIC33CH devices has been designed to provide more performance than current dsPIC DSC cores through:
1) more context-selected registers to improve interrupt responsiveness;
2) new instructions to accelerate Digital Signal Processor (DSP) performance; and 3) faster instruction execution.

This product has design code separately and integrate seamlessly with Microchip’s dual-core dsPIC® Digital Signal Controller, which is optimised for high-performance and time-critical, real-world embedded control.

The dsPIC33CH family delivers unprecedented integration in a small 5 x 5 mm package and includes features such as CAN-FD communications. To reduce system costs and board size, advanced peripherals are available to each core including high-speed ADCs, DACs with waveform generation, analog comparators, analog programmable gain amplifiers and high-resolution Pulse Width Modulation (PWM) hardware. Having two cores, with dedicated peripherals, allows the cores to be programmed to monitor each other for functional safety reasons, facilitating robust system design.

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Microchip’s unique external CAN FD controller enables CAN Flexible Data Rate (CAN FD) in new and existing designs. The MCP2517FD allows designers a simplified path to upgrade from CAN 2.0 to CAN FD and benefit from CAN FD protocol enhancements.

The MCP2517FD-H/SL is available today in a 14-lead SOIC package for sampling and in volume production. The MCP2517FD-H/JHA is available today in a 14-lead VQFN package with wettable flanks for sampling and in volume production.

The CAN 2.0 to CAN FD transition has begun and many automotive and non-automotive designs will benefit from the CAN FD protocol enhancements. Designers have very few choices when picking CAN FD-capable MCUs that are a good fit for their application. The MCP2517FD external CAN FD controller is a viable MCU alternative that helps designers maximise hardware and firmware reuse and minimise the cost and complexity of a redesign.

CAN FD offers many benefits over traditional CAN 2.0 including faster data rates and data byte message expansion. The cutting-edge MCP2517FD CAN FD controller can be used with any microcontroller (MCU), enabling developers to easily implement this technology without a complete system redesign. Since the adoption and transition to CAN FD is in the beginning stages, there are a limited number of CAN FD MCUs available today. In addition, changing a system MCU can come with a significant cost, increased development time and risk. MCP2517FD allows system designers to enable CAN FD functionality by adding only one external component while continuing to utilise the majority of their design.

The MCP2517FD also allows designers to easily add additional CAN FD channels, on top of those that may be available on an MCU.

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The new PIC16F18446 family of microcontrollers are ideal components for use in sensor nodes. Designed with flexibility in mind, the PIC16F18446 and its integrated Analog-to-Digital Converter with Computation (ADC2) runs from 1.8V to 5V, providing compatibility with a majority of both analog output sensors and digital sensors. The 12-bit ADC2 does its filtering autonomously, providing more accurate analog sensor readings and ultimately higher-quality end-user data. Because the ADC2 has the ability to wake the core only when needed, instead of on a pre-determined schedule, the power consumption of the system is lowered, making this MCU ideal for battery-powered applications. This power saving capability also enables sensor nodes to run on small batteries, decreasing end-user maintenance costs and the overall design footprint.

The introduction of the ATmega4809 brings a new series of megaAVR® microcontrollers that were designed to create highly-responsive command and control applications. The processing power of the integrated high-speed Analog-to-Digital Converter (ADC) enables faster conversion of analog signals resulting in deterministic system responses. As the first megaAVR device to include Core Independent Peripherals (CIPs), the ATmega4809 can execute tasks in hardware instead of through software. This decreases the amount of code and can tremendously reduce software efforts for faster time to market. For example, the Configurable Custom Logic (CCL) peripheral can connect the ADC to a customised combination of external triggers through hardware, without interrupting the core, which improves response time while reducing power consumption. The ATmega4809 can also be added to a system to offload functions from more complex microprocessor (MPU)-based designs. By using CIPs to execute command and control tasks in the MCU instead of in the MPU, the risk of delayed responses is decreased, resulting in a better end-user experience.

The ATmega4809 has been selected to be the onboard microcontroller of a next-generation Arduino board. The addition of the ATmega4809 to this board, allows developers to spend less time coding and more time creating. The hardware-based CIPs enable the creation of designs which are more efficient while making the transition from project to production-ready easier than ever before.

Whether it’s used as an initial introduction into embedded development, the main controller of a connected application or as an attach component to offload tasks from a larger system, the role of the 8-bit microcontroller (MCU) continues to expand. While inherently simple to understand and implement, additional hardware and software tools, such as Core Independent Peripherals (CIPs), Intelligent Analog and MPLAB® Code Configurator, enable greater processing power while decreasing the amount of code, power consumption and design effort needed to get to market quickly. Microchip Technology Inc. has introduced two new microcontroller families designed with customer innovation in mind.

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With the booming growth of Internet of Things (IoT) endpoints, security is sometimes an afterthought for many designers, increasing the risk of exposing intellectual property (IP) and sensitive information. To address the growing need for security, the new SAM L10 and SAM L11 MCU families are now available from Microchip Technology Inc.

The new MCU families are based on the Arm® Cortex®-M23 core, with the SAM L11 featuring Arm TrustZone® for Armv8-M, a programmable environment that provides hardware isolation between certified libraries, IP and application code. Microchip enables robust security by including chip-level tamper resistance, secure boot and secure key storage that, when combined with TrustZone technology, protects customer applications from both remote and physical attacks. SAM L10 and SAM L11 devices are available today in a variety of pin counts and package options in volume production quantities.

Both MCU families offer Microchip’s latest generation Peripheral Touch Controller (PTC) for capacitive touch capabilities. Designers can easily add touch interfaces that provide an impressively smooth and efficient user experience in the presence of moisture and noise while maintaining low power consumption. The touch interface makes the devices ideal for a myriad of automotive, appliance, medical and consumer Human Machine Interface (HMI) applications.

Both MCU families offer the industry’s lowest power consumption, as well as have capacitive touch capability with best-in-class water tolerance and noise immunity. When benchmarked for power consumption the SAM L10 received a ULPMark™ score of 405, which is over 200 percent better performance than nearest competitor certified by EEMBC®, the Embedded Microprocessor Benchmark Consortium. Microchip uses proprietary picoPower® technology to provide industry-leading low power consumption in active and all sleep modes.

In addition to TrustZone technology, the SAM L11 security features include an on-board cryptographic module supporting Advanced Encryption Standard (AES), Galois Counter Mode (GCM) and Secure Hash Algorithm (SHA). The secure boot and secure key storage with tamper detection capabilities establish a hardware root of trust. It also offers secure bootloader for secure firmware upgrades. Microchip has partnered with Trustonic, a member of Microchip’s Security Design Partner Program, to offer a comprehensive security solution framework that simplifies implementation of security and enables customers to introduce end products faster. Microchip has also partnered with Secure Thingz and Data I/O Corporation to offer secure provisioning services for SAM L11 customers that have a proven security framework.

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The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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Why vote for us

Ferri-eMMC is optimally designed for a wide range of embedded applications and is fully compliant to the JEDEC standards for eMMC 5.0 protocols. Available in 100/153/169-ball BGA packages, Ferri-eMMC eases PCB design and enables low-cost manufacturing.

Built with industry proven controllers and high quality NAND components, Ferri-eMMC offers advanced NAND management features including error correction, bad block management and health monitoring – enabling the most highly reliable, non-volatile eMMC storage solution for today’s cutting edge industrial, embedded and automotive applications. For automotive IVI applications, Ferri-eMMC features industry leading low dppm, AEC-Q100 qualification, and product longevity support. Embedded applications using HDD or raw NAND today can migrate to Ferri-eMMC® for higher performance and capacity options. Additionally, Ferri-eMMC® can be customized via firmware for specific features and applications.

As the world’s leading NAND controller vendor, Silicon Motion builds its products to the highest quality and reliability standards – backed by uncompromise sales and technical support from design through post production. Silicon Motion’s commitment to automotive and industrial quality is fully incorporated throughout the design, manufacturing and qualification phases of its Ferri-eMMC products.

Key features of Ferri-eMMC includes:
 Advanced Hardware BCH Error Correcting Code (ECC) Engine  StaticDataRefresh™ and EarlyRetirement™ technologies ensure the data reliability  Advanced Global Wear Leveling to enhance reliability  Provides robust data protection- advanced system level protection against unstable power, software / hardware write protect option, multiple user data security zones and software / hardware secure erase function  PowerShield and DataPhoenix technologies prevent data corruption in case of sudden power loss  Automotive IVI compliance to the AEC-Q100 requirements

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Ferri-UFS is a highly integrated solution which combines a feature-wise flash controller compliant with the latest UFS2.1 standard and standard NAND flash memory. Its high-performance storage accessing, better power efficiency, and ease of system design make the Ferri-UFS a fabulous solution for automotive, industry, embedded and portable applications.

The Ferri-UFS leverages industry leading technology and experience in NAND management, and supports the UFS2.1 advanced features such as HS-Gear3 x 2-lane mode and command queue. With extended temperature and various capacity support, offering easy and rapid design integration, the Ferri-UFS also ideally fits the requirements of point-of-sale terminals, networking and telecommunications equipment, and a variety of leading-edge industrial applications. With superior performance, multitasking support, and high stability, the Ferri-UFS can seamlessly serve the needs of a wide variety of mobile devices and new booming embedded/portable applications.

Embedded applications using eMMC today can migrate to Ferri-UFS for higher performance and capacity options.　Additionally, Ferri-UFS can be customized via firmware for specific features and applications.

As the world’s leading NAND controller vendor, Silicon Motion builds its products to the highest quality and reliability　standards – backed by outstanding sales and technical support from design through post production. Silicon　Motion’s commitment to automotive and industrial quality is fully incorporated throughout the design, manufacturing　and qualification phases of its Ferri-UFS products.

Key features of Ferri-UFS controllers:
 Advanced hardware LDPC (ECC) engine
 StaticDataRefresh™ and EarlyRetirement™ technologies ensure the data reliability
 Dynamic power management technology enables multiple power saving modes
 Advanced Global Wear Leveling to enhance reliability
 Robust data protection functions - advanced system level protection against unstable power, software / hardware write protect option, multiple user data security zones and software / hardware secure erase function

 PowerShield and DataPhoenix technologies prevent data corruption in case of sudden power loss
 Automotive IVI compliance to the AEC-Q100 requirements

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The PCIe NVMe FerriSSD® family consists of SM689 supporting PCIe Gen3 x4 NVMe 1.3 and SM681 supporting PCIe Gen3 x2 NVMe 1.3 designed optimally for high-performance mission critical applications. By combining industry proven controller technology, NAND flash and passive components into a small single BGA package, PCIe NVMe FerriSSD® simplifies design efforts, reduces time-to-market while protecting from NAND technology migration concerns.

The SM689 supports embedded DRAM with Data Redundancy with PCIe Gen3 x4 interface – exhibiting sequential read speed of up to 1.45GB/s and sequential write speed of up to 650MB/s. The SM681 DRAM-Less series feature the best balance of saving/performance - cost saving from eliminating DRAM while maintaining DRAM-like performance via HMB (Host Memory Buffer). Both available in 3D TLC/MLC/SLC modes, the unique flexible design can support multiple capacity configurations ranging from 4GB to 256GB and include enterprise-grade advanced data integrity and reliability capabilities using Silicon Motion's proprietary end-to-end data protection, ECC and data caching technologies. The PCIe NVMe FerriSSD targets at embedded computing applications in industrial, commercial, enterprise and automotive end-markets. It’s customizable via firmware and offers enhanced reliability and robust data integrity features that are essential for the extreme operating environments of these applications.

The PCIe NVMe FerriSSD storage solutions are popular with automotive and industrial designers, allowing them to replace a hard disk drive with reliable solid-state alternatives and enabling significantly better performance for applications such as AI and autonomous driving.

Its set of features includes:
 End-to-end data path protection, which applies error correction code (ECC) to the SSD's SRAM and DRAM buffers as well as to the primary NAND Flash memory array
 DRAM data cache to ensure data programming and enable data redundancy, without delaying host processor operations
 Hybrid Zone which enables a single disk to be partitioned into single-level cell (SLC) and multi-level cell/three-level cell (MLC/TLC) zones, enabling faster access speeds and data retention
 Intelligent Scan/DataRefresh protects against the higher data loss from operating at high temperatures
 NANDXtendTM technology incorporating Silicon Motion's proprietary 4th generation high-performance LDPC ECC engine with RAID, ensuring better data integrity even in extreme physical environments
 Supports industrial temperatures from -40 to 85 degrees Celsius
 Densities ranging from 16GB to 256GB at launch

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The growing popularity of cloud based services, combined with increasing emphasis on data-intensive applications (such as artificial intelligence, augmented reality, etc.) mean that data center workload demands are greater and also more varied than ever. The advent of network virtualization is having a major impact too, with complex multi-tenant business models now starting to be utilized. Agile semiconductor solutions are consequently called for that can address the changing nature of the data center landscape and the distinct storage requirements that are associated with each specific use case.

In response to this, back in March this year, Marvell launched the 88NR2241 - which is recognized as the industry’s first NVMe SSD switch. This highly sophisticated device has a DRAM-less architecture and is designed to support low latency NVMe transactions with only minimal associated overhead. It facilitates the aggregation and virtualization of up to 4 NVMe SSD controller ICs, thereby allowing workloads that the host central processing unit (CPU) would otherwise have to take care of to be offloaded. As a consequence, the CPU can concentrate on other tasks, with overall system performance and reliability hence being boosted significantly. This switch has the capacity to deliver up to 6.4GB/s of data throughput and up to 1.6M random input output per second (IOPS). It is optimized for use in the multi-tenant, virtualized cloud and enterprise data center environments that are currently being implemented - providing engineering teams with the flexibility needed to construct SSD architectures that precisely optimize workload efficiencies in relation to key application criteria (like performance, power consumption or the costs involved).

Through this NVMe switch’s ability to virtualize the SSDs that it is connected to at the back end, the storage parameters are no longer constrained by the feature sets of these SSDs - thus extending the functionality that can be benefitted from (including multiple namespaces, multiple reservations, etc.). As a result using just low-cost, consumer-class NVMe SSDs it is possible for enterprise-class levels of performance to be derived.

With the RAID feature set, the 88NR2241 can virtualize multiple attached physical back end SSD devices into a single logical unit. This can be done for several different reasons - for the purposes of data redundancy (RAID 1), for improving performance figures (RAID0), or to get a combination of both (RAID10).

The Marvell 88NR2241 switch is already being seen in numerous customer SSD storage solutions - playing an integral part in the recently released Lite-On/Plextor M9Pe Extreme NMVe drives (along with the company’s 88SS1093 SSD controller ICs) and Innodisk’s hardware-accelerated RAID SSD boot cards (accompanied by the 88NV1160 SSD controller ICs). It is also expected to see heavy deployment in the new breed of storage card formats that are in the process emerging, such as enterprise data storage form factor (EDSFF) and next generation small form factor (NGSFF).

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Toshiba has new generation of UMOS-8 and 9 are high-efficiency MOSFET series specifically designed for use in the secondary side of AC-DC power supplies for notebook PC adapters, game consoles, servers, desktop PCs, flat-panel displays, BLDC motor etc., as well as DC-DC power supplies for communication equipment, servers and data centers. Fabricated with the latest Gen-8 and Gen-9 trench MOS processes, U-MOSVIII-H U-MOSIX-H will help improve the efficiency of power supplies. To use this process, which can reduce MOS FET’s Rdson and can get good temperature dependency and get high efficiency.

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SGM37604A is a high efficiency four-channel series backlight LED driver with 1:3300 dynamic brightness adjustment range. It is suitable for cellphones, tablet computers and other electronic devices with liquid crystal display below 12 inches. The input voltage is up to 24V, and the efficiency can be up to 90%. The 12-bit I2C programmable 4096 steps dimming resolution with a minimum of 12.1μA to a maximum of 40mA per channel, makes the device meet the requirements of dark environment and outdoor high light ambient. Hybrid PWM + I2C dimming for higher LED driver optical efficiency makes the device suitable for CABC applications. It has less than 1% channel current matching degree and 3% current accuracy. The current changes exponentially at quite low brightness, makes the brightness adjustment smoother. Pulse current output at low brightness is supported to avoid LED color temperature drift. Each channel can be opened or closed independently and supports phase shift output to reduce EMI. It has complete protect functions such as short circuit, open circuit, over temperature and input over current protect.

Up to 8S4P white LED applications. Each channel 12.21μA to 40mA output ability. 12-bit I2C dimming resolution of 4096 steps. Hybrid PWM + I2C for higher LED driver optical efficiency. Current programmable exponentially at quite low brightness. Pulse current output at quite low brightness to avoid LED color temperature drift. Phase shift output at quite low brightness to reduce EMI. Each channel can be opened or closed independently.

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The information above was provided by the nominee and does not represent the organizer's views

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Weltrend USB Type- C PD Controller – The Next Generation Fast and Smart Charging Weltrend’s USB Type-C PD (Power Delivery) controllers address a broad set of market segments for the emerging USB Type-C products including power adapters for USB Type-C based notebooks, 2-in-1s, tablets, and smartphones as well as USB Type-C based accessories such as car chargers, power banks, power strips, docking stations and dongles.

The USB PD controllers support USB PD 3.0 Programmable Power Supply (PPS) specification as well as Qualcomm® Quick ChargeTM 4 or Quick Charge 4+ specification, designed for USB Type-C power source applications. The PPS specification is typically used for Sink Directed Charge for the battery in mobile devices and is now rapidly becoming the preferred choice of smartphone OEMs for safe and rapid charging.

Quick Charge 4 and Quick 4+ is the latest fast-charging specification from Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, offering up to 20% faster charging, up to 30% greater efficiency, and running 5% cooler when compared to Quick Charge 3.0. Quick Charge 4 and Quick Charge 4+ also support USB PD and PPS, helping to standardize the capabilities of adaptors using these technologies, while being designed to deliver headline-making charging performance that provides five hours of talk time from just five minutes of charging, along with comprehensive safety features.

Weltrend’s USB PD controllers minimize external components by integrating USB PD baseband PHY, Type-C detection, shunt regulator, voltage and current monitors, NMOS or PMOS load switch driver and an 8-bit MCU to allow small form factor and low BOM cost. Wide operation voltage range (3V to 24V) supports PD 3.0 Programmable Power Supply (PPS) specification. One-Time-Programmable or Multi-Time-Programmable ROM is provided for program code and user configuration data.

Weltrend’s USB PD controllers are certified for USB PD compliance by USB-IF and for Qualcomm Quick Charge 4 or 4+ compliance by UL. The products have been adopted by several major global notebook PC and smartphone OEMs.

Weltrend’s USB PD controllers adopt high-voltage semiconductor process so it is reliable and is able to minimize external components by integrating USB PD baseband PHY, Type-C detection, shunt regulator, voltage and current monitors, NMOS or PMOS load switch driver and an 8-bit MCU, allowing small form factor and low BOM cost.

A One-Time-Programmable or Multi-Time-Programmable ROM is provided for program code and user configuration data. With Weltrend’s proprietary hardware and software tool sets, users can easily program and/or update the firmware when needed during the product development stage or at the production line.

Weltrend is one of the few fabless semiconductor companies in the world that possesses expertise that lies across digital and analog designs with product portfolio encompassing MCUs and power ICs. This is a key factor for the company’s success roll out of USB PD product line as it requires both digital and power knowhow (i.e. “smart power”) as well as strong supporting resources for firmware coding. Weltrend’s strong firmware engineering team, leveraging its experiences from the MCU product line, can provide fast turnarounds in firmware customization per customer’s design specification.

In addition, by collaborating with industry’s leading power conversation IC providers such as Power Integrations (NASDAQ: POWI), ON Semiconductor (NASDAQ: ON), and Diodes (NASDAQ: DIOD), Weltrend provided complete power adapter reference designs ranging from 18W to 100W for fast design turn-arounds.

All of Weltrend’s USB PD controllers are certified for USB PD compliance by USB-IF and for Qualcomm Quick Charge 4 and 4+ compliance by UL so users can be assured with product compatibility.

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The information above was provided by the nominee and does not represent the organizer's views

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The resistance of MOSFET is mainly composed of the chip itself and package wire bonding. For practical application, lowering the resistance can lower the power consumption, heat and also increase the power transmission efficiency to extend the lifetime of MOSFET. NIKO uses the new generation of the double gate trench process technique. It can reduce the conduction resistance effectively and also optimize the dynamic parameters (Qgd, Crss) significantly. In terms of package, NIKO utilizes the PowerFET package technique shown in Fig. 1. To decrease the resistance induced by wire bonding, NIKO directly laminates the chip and package shell together. Simultaneously, the metal shell could also be the upper path of cooling and lower the surface temperature of MOSFET effectively. NIKO combines the above advantage of new generation process and package technique together. The latest product which package size is 5mm X 6mm, the mainstream size in the market, PR806BA56, has been released to the market and its Rds(on) is the lowest in the market which is 0.3~0.4mΩ(typ@Vgs=10V), VDS=30V. NIKO contributes to developing the new generation power device, PowerFET. PowerFET has an incredible cooling ability, extremely low conduction resistance. Furthermore, it also has a better power density. It could be used in many power kinds of application like DC-DC converter, load switch and the demand of future electronic system.

Portable and wearable electronic product flourishes recently. So the design of the device should remain the output power but the size must be lighter, shorter and smaller. Utilizing new package technique for PowerFET shown in Fig. 2 can diminish the resistance resulting from package by directly laminating the chip and package shell instead of adopting wire bonding to connect the pin. In the meantime, there is no need to use resin as a protection to decrease the thickness of the device, either. Therefore, utilizing chip and metal shell directly contact as the connection and metal shell could also be the cooling for the chip to decrease the surface temperature of MOSFET.

Package type comparison
PowerFET versus Conventional package
Thickness : Decreasing 50% (around 0.5mm)
Conduction resistance : Decreasing 20%~30% to increase the transmission efficiency

Power dissipation : Conspicuously decreasing the thermal resistance from inside interface to the top of outside shell and effectively decreasing the surface temperature Package availability rate : Over 60%(Conventional package: < 40%)

Besides the excellent performance, PowerFET also has the advantage of lower package cost when mass production. For power device, operating in environment like portable and wearable electronic product is relatively extreme. It needs more stable power and higher transmission efficiency, moreover, the design area also matters. Therefore, the design environment is more severe. However, NIKO’s latest product, PowerFET, successfully makes it come true. NIKO not only increases the transmission efficiency and scales down the area of product but also provides a consistent output power. It is convinced that PowerFET will be all the rage in power society soon.

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LTM4661 is a low power step-up µModule® regulator in a 6.25mm x 6.25mm x 2.42mm BGA package. Only a few capacitors and one resistor are required to complete the design, and the solution occupies less than 1cm² single-sided or 0.5cm² on double- sided PCBs. The LTM4661 incorporates a switching DC/DC controller, MOSFETs, inductors and supporting components. The LTM4661 operates from a 1.8V to 5.5V input supply, and continues to operate down to 0.7V after start-up. The output voltage can be set by a single resistor ranging from 2.5V to 15V. The combination of the small, thin package and wide input and output voltage range is ideal for wide range of applications including optical modules, battery-powered equipment, battery-based backup systems, bias voltage for power amps or laser diodes and small DC motors.

The LTM4661 can deliver 4A continuously under 3.3VIN to 5VOUT, and 0.7A continuously under 3.3VIN to 12VOUT. The LTM4661 employs synchronous rectification, which delivers as high as 92% conversion efficiency (3.3VIN to 5VOUT). The switching frequency is 1MHz, and can also be synchronized to an external clock ranging from 500kHz to 1.5MHz. The LTM4661 1MHz switching frequency and dual phase single output architecture enable fast transient response to line and load changes and a significant reduction of output ripple voltage. The LTM4661 has three operation modes: Burst Mode® operation, forced continuous mode and external sync mode. The quiescent current in Burst Mode operation is only 25µA, which provides extended battery run time. For applications demanding the lowest possible noise operation, the forced continuous mode or external sync mode minimize possible interference of switching noise. The LTM4661 features an output disconnect during shutdown and inrush current limit at start-up. Fault protection features include short-circuit, overvoltage and overtemperature protection. Summary of Features: LTM4661

• Complete Solution in <1cm² (Single-Sided PCB) or 0.5cm² (Dual-Sided PCB)
• Input Voltage Range: 1.8V to 5.5V, Down to 0.7V After Start-
• Output Voltage Range: 2.5V to 15V
• Up to 4A DC Output Current
• ±3% Maximum Total DC Output Voltage Regulation Over Load, Line & Temperature
• Output Disconnect in Shutdown
• Inrush Current Limit
• External Frequency Synchronization
• Selectable Burst Mode® Operation
• Output Overvoltage & Overtemperature Protection
• Ultrathin 6.25mm × 6.25mm × 2.42mm BGA package

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iHP Series, a new configurable intelligent high power system, designed for a wide range of medical and industrial applications. The new modular power system provides accuracy, resolution and stability as either a programmable voltage or current source. It provides up to 24 kW in 3 kW increments and can be configured for up to eight outputs using a wide variety of plug-in modules that address a large range of voltages and currents.

Safety approvals secured by Artesyn eliminate the need for an isolation transformer in medical equipment. The iHP power system also has industrial safety approvals and meets the SEMI F47 voltage sag tolerance standard for semiconductor processing equipment.

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Modern rail infrastructure requires a wide range of DC-DC converters to power a variety of new services for both freight and commuter markets. Commuter rail systems require mobile office communication capabilities with the infotainment capabilities of home. Freight rail systems require monitoring and control capabilities to assure the safe and timely delivery of all goods onboard. While both commuter and freight systems demand reliable and high-performance power systems for the necessary safety and security measures (onboard and at station). ChiP is Vicor's latest generation of power package family, with the size ranging from 2223 (22mm*23mm), 3623 (36mm*23mm), 4623 (46mm*3mm), to 6123 (61mm*23mm). The DCM3623 for railway products is an isolated，regulated DC-DC converter module that can operate from an unregulated, wide range input to generate an isolated DC output. DCM3623 supports a wide input voltage range (43V-154V) in only 36*23*7mm and has adjustable output voltage from 3.3V to 48V. It offers output up to 240W within the area of 36mm*23mm at 93% efficiency.
It has been more than 30 years sinceVicor started selling commercial power modules in the market on a large-scale,. Since then all power module companies' products feature bricks, thermal substrates, cylindrical pins, large size and high profile. Vicor innovated its original products and invented a new package. This standard package enables stereoscopic heat dissipation, and supports all Vicor’s power topologies, making power density of the power module reach a new level and become a new benchmark in the industry. Vicor is a leading supplier of rail power modules and offers reliable and robust first- and second-generation bricks that have been widely adopted by railway users for a long time. The ChiP DC-DC power modules are specially designed to meet the electrical specifications and mechanical requirements in railway industry based on the old bricks, enabling railway customers to use the next-generation, high performance and reliable modules. Comparing to similar products in the industry, Vicor's ChiP products for railway have higher power density and can be used separately or for high-power arrays in parallel. With comprehensive application guidelines, they can easily improve the performance of power supply design in railway products.

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A linear battery charging circuit for loosen regulated power input. It’s applicable for powering from the inducting coil, rectified output with less storage cap, vibration coil, thermal-coupler pile, windmill generator and hub generator; and could charge different cell chemistry types including Li+/poly, LiFe, LTO, NiMH and EDLC. The charging procedure profiles in trickle pre-charging with force-starting window, CCCV with time-controlled floating and saturation charging, balancing for 2 serial cells; terminating against residual current level and floating time-out. It also features resistive loss compensation, fold-back floating, thermal regulation and input voltage clamping. A unique application specific design for IoT terminals with mAh~Ah volume batteries, charging starts when powering >20μA in range <30V， with balancer for 2 cells, for multi-chemistries and could parallel for multi input.

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The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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CS32G020 series is a USB Type-C controller which can support USB Type-C and PD3.0 protocol and can be used in PC Power Adapter, Mobile Phone Charger, Mobile Power Bank, Car Charge and other fields. CS32G020 has embedded arm Cortex-M0 kernel which is the newest microprocessor of arm. As the CPU is running at 48MHz, it can support a wide range of industrial controls and applications that required high performance of CPUs. CS32G020 includes 64K byte program flash, configurable data flash size (shared with program flash), 4K bytes LDROMU and 8K byte SRAM.CS32G020 package including QFN24 and QFN32. Type-C and USB PDs protocol are supported, including USB PD3.0 V1.1 protocol, RP and RD of CC port are configurable, also support 2-way Type-C port, both CC ports can carry out PD communication independently, and CC port support 20V high voltage. There are Two built-in high voltage (20V) control ports. Fast role swap (FRS) is supported too. CS32G020 also supports other protocols such as QC4.0 / QC3.0 / FCP and BC1.2. There are no more than 27 GPIO pin, 3 16-bit timers with 8 bits predivision are built-in, also support for multiple Communication port such as UART, SPI,I2C.

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With the increment of solar arrays, voltage of the solar arrays is up to 1500 VDC. To meet this requirement, Mornsun 200-1500VDC wide input voltage PVxx-29Bxx series, featuring 200-1500VDC input voltage, high isolation voltage of 4000VAC and can significantly be used at high altitudes up to 5000m. It is widely used in photovoltaic power generation and high voltage frequency conversion, provides a stable operating voltage to the control device.

Advantages:
200-1500VDC ultra-wide input voltage for utility-scale PV system cost reduction;
Input under-voltage protection ensuring system stability;
Suitable for high-altitude applications ( up to 5000 meters ).
The PVxx-29Bxx series chooses the mature reliable conventional voltage specification switch device. The power conversion unit adopts the design scheme of double-winding, double-tube series and synchronous isolation drive.Combined with the key circuit technology, the error range of double pipe pressure equalization is guaranteed to be less than 5%, which reduces the dependence on high voltage unconventional devices and improves the product reliability. This series adopts the patented technology of independent high voltage start-up, and series several small volume and low voltage switching devices.Through the special circuit average pressure,ensure that the product in the full range of input voltage fast start and turn off the starting circuit after the completion of the start-up,reduce the loss of the normal work of the product.At the same time, under the condition of short circuit protection, it is fully controlled to protect the hiccup time, reduce short-circuit power and improve product reliability.

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The P9242-G is a highly integrated, magnetic induction, wireless power transmitter supporting up to 15W. The system-on-chip operates with an input voltage range of 5V to 19V. The P9242-G is optimized for fixed frequency wireless power transfer for improved EMI and co-existence with other electronic systems. Normally, the device would be complemented by an external Step-down pre-regulator stage. The P9242-G converges all popular wireless charging protocols including WPC Extended Power Profile (EPP), iOS, and Android proprietary fast charging modes. The P9242-G transmitter IC includes an industry-leading 32-bit ARM® Cortex®-M0 processor offering a high level of programmability while consuming extremely low standby power. The P9242-G features two LED outputs with pre-defined user-programmable blinking patterns, and programmable over-current protection supporting a wide range of applications. The I2C serial communication allows the user to read information such as voltage, current, frequency, and fault conditions. The P9242-G includes an under-voltage lockout and thermal management circuit to safe guard the device under fault conditions. P9242-G typical application includes, EPP wireless charging pads, iOS and Android Fast Charging Pads, Cradles, Tablets, and after Market Automotive Wireless Charging Pad etc. The P9242-G is available in a lead-free, space-saving 48-pin QFN package. The product is rated for a -40ºC to +85ºC operating temperature range.

Wireless charging adoption is on the rise, and many consumers realize that wireless charging products offer the best convenience with quality, safety and reliability. By now, most of today’s leading smartphone manufacturers already support wireless charging and high volume smart phone already available with wireless power functionality. The end consumers appear eager to make wireless power a bigger part of their daily lives. The P9242-G converges all popular wireless charging protocols including WPC Extended Power Profile (EPP), iOS, and Android proprietary fast charging modes. Generally, a wireless power charging system has a base station with one or more transmitters that make power available via DC/AC inverter(s) and transmit the power over a strongly-coupled inductor pair to a receiver in a mobile device. The P9242-G contains features that ensure a high level of functionality and compliance with the WPC requirements, such as a power path that efficiently achieves power transfer, a simple and robust communication demodulation circuit, safety and protection circuits, configuration, and status indication circuits. P9242-G supports constant frequency operation during power transfer. The bridge input voltage is increased or decreased to control P9242-G output power while its operating frequency is fixed at 127.7 kHz. The accuracy depends on that of the external crystal oscillator or clocker. If IDT’s clock IC or the recommended MEMs clock IC is used, the accuracy of the operating frequency is guaranteed of 127.7 kHz, +/-6Hz. USB Adaptor detection circuit is implemented in P9242-G by Firmware. P9242-G can detect regular USB port, USB DCP, and QC2.0/3.0 adaptors. When a USB port or USB DCP adaptor is plugged in, P9242-G functions as a BPP transmitter and only deliver up to 5W at Rx output. Features less external components, and based on IDT’s EVK, it can help customers easily to build up all-in-one wireless transmitter which can support most of smartphone with wireless receiver.

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CUI’s Intelligent Control of Energy (ICE) Block is a rack-mount, lithium ion battery storage device delivering 12 kW of output power in 4U of space. The ICE block hardware shaves peaks by supplying power for peak load events and automatically recaptures power during low utilization periods. When paired with partner Virtual Power Systems’ (VPS) ICE software, the ICE Block hardware and ICE software combine to deliver more power within data centers by elasticizing it as a resource, resulting in lower operating costs and less redundant power supply capacity. This modular hardware ultimately provides operators with a plug and play way of bringing software defined power to data centers.

The ICE Block features hot-swappable modules, 208 to 240 V input/output feeds, and single or three-phase configurations. Delivering 12 kW of output power per rack, the ICE Block is stackable up to ten units at the end of row for 120 kW of output capability with N+1 redundancy per phase. The ICE Block is best of all designed to work with existing IT equipment, giving operators greater flexibility in improving data center power capacity.

The ICE Block is an innovative, industry first device bringing the principles of elastic power to data centers. Data center power capacity has emerged as one of the most critical areas that needs to be addressed to support the growth of IoT, mobile, and supporting infrastructure. With the use of the cloud constantly on the rise, the strain on data centers is greater than ever, which is why smart power management techniques like Software Defined Power (SDP) are needed to improve power infrastructure efficiency.

With the ICE Block and complete ICE hardware/software system, data center operators can see up to a 15-25% reduction in operating costs coupled with 40-60% less in capital expenditures. This is because the ICE Block and ICE system take the existing infrastructure and deliver power more efficiently by elasticizing it as a resource. These SDP principles intelligently and dynamically deliver power to racks and shave high peak demands to free-up redundant power supply capacity. These battery-storage capabilities ultimately manage peak demands by utilizing power stored during low utilization periods.

In delivering power more efficiently, the ICE Block allows operators to avoid the costly and time-consuming process of expanding their existing power infrastructure. In addition, the ICE Block enables data centers to continue their aggressive growth paths via a solution that can be installed and initialized in just days compared to the months required with traditional approaches. Data center operators can immediately experience significant improvements in operational flexibility, utilization, and management thanks to the ICE Block.

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For energy harvesting and power backup applications in harsh, high humidity environments, ruggedized 225 EDLC-R ENYCAP series electrical double-layer energy storage capacitors are the industry’s first to offer useful life of 2000 hours at +85 °C and meet the highest class of moisture resistance: the biased 85 / 85 1000-hour test. Their high humidity resistivity allows for use in a wide range of industrial, renewable energy, and automotive applications, including smart meters, handheld electronics, robotics, solar panels, E-latch door systems, and emergency lighting. Available in eight small case sizes ranging from 16 mm by 20 mm to 18 mm by 40 mm, 225 EDLC-R ENYCAP capacitors offer high power density to 4.1 Wh/kg, capacitance values from 20 F to 60 F, and a maximum rated voltage of 2.7 V. The RoHS-compliant devices feature rapid charge and discharge performance and are available in through-hole versions.
The long useful life of 225 EDLC-R ENYCAP series capacitors is double that of standard EDLCs, while their high moisture resistance allows them to be used in applications where high humidity would compromise standard devices. This allows for maintenance-free operation to lower costs, while providing engineers with greater design flexibility in a wide range of industrial, renewable energy, and automotive applications.

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Circuit Protection PPTC Resettable Fuse
Operating Current:0.5A~10A, Maximum Voltage: 32V
Temperature Range: -40℃ to 125℃
Very Low Resistance/High Hold Current
UL/cUL/TUV Certified, AEC Q-200 Compliant Products
Application: High Performance Automotive and Industrial Control
Fuzetec FHE high temperature, automotive grade PPTC devices. Groundbreaking PPTC formula raise the temperature range up to 125℃ (Compare with regular PPTC device’s 85℃) and improve voltage rating to 32 V make it the ideal overcurrent solution for high performance automotive and industrial applications. Fuzetec products compliant with automotive industry standard, AEC-Q200, provide superior quality and high reliable product for the automotive electronics market。

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TE’s Sliver internal cabled interconnects provide one of the most flexible solutions in the market for making internal input/output (I/O) connections on the board. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs. This new connectivity technology simplifies design and helps lower overall costs by eliminating the need for re-timers and more costly lower-loss PCB materials.
As an extension of the Sliver interconnect family, Sliver 2.0 has been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification connector, and identified as the standard and required product by several industry consortias including COBO, Gen-Z, EDSFF and Open Compute Project (OCP) for current and next-generation server and storage designs.
Key Features
• High density, hot pluggable, high performance and cost effective
• Multi-lane high speed connector, rated up to 56G PAM-4 (112G)
• Proposed alternative or replacement to many form-factors including M.2, U.2, and PCIe
• Options available to connect to PCB card edge, cable or optics
Specifications
• Chosen for performance, density, flexibility, and robustness
• Meets all current protocol performance requirements for PCIe Gen3/4 (8G & 16G), SAS-3/4 (6G, 12G, & 24G), Ethernet protocols (10G & 25G per lane), InfiniBand (28G), and is expected to meet performance for IEEE & OIF 56 Gbps, PCIe Gen 5, and SAS5
• Sizing options include 1C (x4), 2C (x8), and 4C/4C+ (x16) in both right angle, and vertical sizes. All module cards can plug into any alternate configuration by design. Non-standard variants are also available in X32 and X16+ high power.
Applications
• Data center and networking equipment: servers, switches, routers, High Performance Computing (HPC), storage devices and wireless base stations and radios.
• Internal Cabled Solution Options: Chip to Chip, Chip to I/O, Chip to Backplane and Board to Board
• PCB Card Edge (BTB) solutions

Sliver 2.0 interconnects have been adopted as the SNIA SFF TWG Technology Affiliate’s SFF-TA-1002 specification multi-lane high speed connector for their performance, flexibility and lower costs. Multiple groups within the industry including the Consortium for On-Board Optics (COBO), the Gen-Z Consortium (Gen-Z), Open Compute Project (OCP) and Enterprise & Data Center SSD Working Group (EDSFF) have adopted Sliver 2.0 internal cabled and card edge interconnects as the standardized connector solutions in their server, storage and networking designs.
The multi-lane high speed connector can provide up to 56G PAM-4 (112G)data rates, and meets all current protocol performance requirements for PCIe Gen 3/4 (8G & 16G), SAS-3/4 (6G, 12G, & 24G), Ethernet protocols (10G & 25G per lane), InfiniBand (28G), and is expected to meet performance for IEEE & OIF 56 Gbps, PCIe Gen 5, and SAS-5.

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CeraCharge™: The first solid-state rechargeable battery in SMD technology. Depending on requirements, the number of charge/discharge cycles this battery is able to perform ranges from several dozens to up to 1000. With its compact EIA 1812 package (4.5 x 3.2 x 1.1 mm) it offers a capacity of 100 µAh at a rated voltage of 1.4 V. This battery is also capable of delivering currents in the order of several mA for short periods. Thanks to the SMD technology, placement of the battery is easy and it can be processed using reflow soldering techniques, which in turn reduces the production cost of the end product.

Main applications
• IoT devices, real-time clocks, Bluetooth beacons, systems for energy harvesting.
Main features and benefits
• Compact SMD design in EIA 1812 case size
• Easy placement and processing using reflow soldering techniques
• Solid ceramic electrolyte rules out the risks of fire, explosion, or leakage of liquid electrolyte.

PowerHap: The innovative PowerHap™ piezo actuator with haptic feedback and integrated sensor functionality is now available in three compact types – 2.5G, 7G and 15G – which can achieve an very high acceleration of 2.5 g, 7 g and 15 g, respectively, under a load of 100 grams. These components also offer unrivalled performance in terms of force and response time, and thus offer an unprecedented quality of haptic feedback. The compact and powerful actuators enhance the sensory experience of HMIs significantly by engaging the full range of human tactile sensitivity.

Main applications
• Vehicles, smartphones and tablets, household appliances, ATMs and vending machines, game controllers, industrial equipment and medical devices.
Main features and benefits • High acceleration
• Very large forces
• Large displacement
• Extremely low insertion height
• Fast response time of < 1 ms
• Low energy consumption per click.

CeraCharge™: In contrast to most common technologies, CeraCharge is a solid-state rechargeable battery with no liquid electrolyte. The battery is based on a multilayer technology, similar to MLCCs. This means that a relatively high energy density and smallest volume are combined with the safety and high volume manufacturing benefits of ceramic multilayer components. In addition, the use of a solid ceramic element as an electrolyte rules out the risk of fire, explosion, or leakage of liquid electrolyte.

To increase the capacity and the voltage, any number of individual CeraCharge components can be connected in series and parallel. This opens up a wide range of possible applications – particularly in devices intended for the Internet of Things. These include, for example, real- time clocks, Bluetooth beacons, wearables or systems for energy harvesting.

PowerHap: Compared with conventional electromagnetic solutions such as eccentric rotary motors (ERMs) and linear resonant actuators (LRAs), the PowerHap features high acceleration and force combined with low insertion height and the fastest response time – and all that with extremely low energy consumption per click of 1 mJ, 3 mJ and 8 mJ, respectively, and in a single component with integrated sensor functionality.

Unlike conventional electromagnetic solutions PowerHap actuators can excite the entire stimulation range between 1 Hz and 300 Hz. They thus have no significant frequency or amplitude limitations for customized haptic feedback to key human mechanoreceptors. In this way, the new actuator enables designers to custom develop high-definition haptic feedback profiles that users expect from cutting-edge HMIs. Applications for the PowerHap can be found, for example, in vehicles, smartphones and tablets, household appliances, ATMs and vending machines, game controllers, industrial equipment and medical devices.

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Reliability is paramount when customers bring your products into their homes—that's part of why our engineers designed Positive Lock receptacles and housings. As a popular series of receptacles & housing, Positive Lock is featured with combination of low insertion force and high retention. Our vast array of Positive Lock products optimizes the customer’s choice when selecting the most suitable receptacle for their designs, whether they be home appliances, industrial equipment, or automotive applications.
Positive Lock offers standard and high temperature versions. The high temperature Positive Lock receptacles and housings can stand challenges from high-temperature harsh environments. Nickel-plated high-strength low-alloy steel terminals are rated up to 250°C, and new liquid crystal polymer housing is rated up to 240°C for demanding high temperature applications. Both straight and flag configurations are available.

Note:Positive Lock is a trademark.

Positive Lock receptacles and housings are among the best in class when it comes to performance, ease-of-use, and cost competitiveness
1. Positive Lock is featured with combination of low insertion force and high retention, offering highly reliable connections.
2. For high-temperature version, Nickel-plated high-strength low-alloy steel terminals are rated up to 250°C, and new liquid crystal polymer housing is rated up to 240°C for demanding high temperature applications. Both straight and flag configurations are available.
3. Available for wide range of wire sizes and housing offered in choice of materials and colors, offering cost-effective property and flexible design possibilities.

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As embedded systems and IoT devices become more sophisticated, engineers require more from their go-to test solution – the oscilloscope. To efficiently characterize and debug complex systems, designers need to look at a much larger number and wider variety of signals than in the past. Usability and fast time-to-insight are critical to staying on time and budget. As a clean-slate design, the 5 Series MSO is the world’s first midrange oscilloscope (350 MHz-2 GHZ) with the versatility and deep signal insight needed to meet these challenges.
With an innovative pinch-swipe-zoom touchscreen user interface, the industry's largest high-definition display, and 4, 6, or 8 FlexChannel™ inputs that let engineers measure one analog or eight digital signals, the 5 Series MSO is ready for today’s toughest challenges, and tomorrow’s too. It sets a new standard for performance, analysis, and overall user experience.

FlexChannel technology
The 5 Series MSO redefines what a Mixed Signal Oscilloscope (MSO) should be. FlexChannel technology enables each of the inputs on the instrument to be used as a single analog channel or eight digital channels. The conversion is done by simply attaching a TLP058 logic probe to any input.
The 5 Series MSO offers a new level of digital channel integration. Digital channels share the same high sample rate (up to 6.25 GS/s) for fine timing resolution, and long record length (up to 125 Mpoints) for long time captures as analog channels. Previous-generation MSOs required tradeoffs, with digital channels having lower sample rates or shorter record lengths than analog channels.

Unprecedented signal viewing
The stunning 15.6" (396 mm) display in the 5 Series MSO is the largest display in the industry, providing 100% more display area than a scope with a 10.4" (264 mm) display. It is also the highest resolution display, with full HD resolution (1,920 x 1,080), enabling users to see many signals at once with ample room for critical readouts and analysis.

Exceptionally easy-to-use UI
Scopes have included touch screens for years, but the touch screen has been an afterthought. The 5 Series MSO's capacitive touchscreen provides the industry's first oscilloscope user interface truly designed for touch. Smooth, responsive front panel controls allow also users to make adjustments with familiar knobs and buttons, and a mouse or keyboard can be added as a third interaction method.

Industry leading vertical resolution
The 5 Series MSO has the performance to capture the signals of interest while minimizing the effects of unwanted noise for high-amplitude signals while seeing smaller signal details. At the heart of the 5 Series MSO are 12-bit analog-to-digital converters (ADCs) that provide 16 times the vertical resolution of traditional 8-bit ADCs.
A new High Res mode applies a Finite Impulse Response (FIR) filter based on the selected sample rate that maintains the maximum bandwidth possible for that sample rate while preventing aliasing and removing noise above the usable bandwidth for the selected sample rate. New lower-noise front end amplifiers further improve the 5 Series MSO's ability to resolve fine signal detail.

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Easily integrate infrared data, images, and videos to produce more comprehensive research analysis For precise research, science, and engineering applications, just seeing heat is not enough — it needs to be measured and analyzed as well. The new Fluke® RSE300 and RSE600 Infrared Cameras are the first fully-radiometric, fixed-mount cameras from Fluke with advanced features. The RSE300 and RSE600 cameras continuously stream up-to-60 frames of data per second, allowing for detailed monitoring of temperature patterns and variances. With the included SmartView® desktop software, users can remotely focus the camera, auto-capture images, adjust level and span, and analyze infrared videos frame-by-frame. The software also makes it easy to edit images, generate customized reports, and export images to multiple formats to share thermal data quickly.

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The IQgig-5G is a fully-integrated, non-signaling solution for testing 5G mmWave products at both the 28 GHz and 39 GHz frequency bands. All signal generation, analysis, and RF front-end routing hardware are self-contained inside a single chassis. The IQgig-5G is license-upgradeable to support the pre-5G and 3GPP standards evolution with up to 1 GHz of tester bandwidth. The IQgig-5G solution has three bi-directional source and measurement ports each with 2.92 mm connector coaxial interface.

Fully Integrated 5G mmWave Test System
The IQgig-5G is the simplest solution for testing 5G mmWave products as all the required hardware, including the RF test front ends, is self-contained inside a single chassis. Both the 28 GHz and 39 GHz RF front ends are fully integrated inside the chassis thus enabling the source and measure capabilities to be calibrated at the instrument front panel. This full hardware integration significantly reduces the test set up complexity and improves efficiency.

Fast Path from R&D to Manufacturing
The IQgig-5G provides a fast path from R&D to DVT to manufacturing due to the efficient re-use of test scripts and calibration algorithms with a simple and efficient tester set up.

Simplest 5G Test Fixture Connections
The IQgig-5G solution has three bi-directional source and measurement ports each with 2.92 mm connector coaxial interface which enable both horizontal and vertical antenna polarization test with a single coaxial interface. The user does not need to worry about adding, tracking, calibrating and maintaining different type of waveguide interfaces for different bands as the IQgig-5G coaxial interface covers all of the bands.

No Compromise on 5G performance
The IQgig-5G’s 1-GHz of tester bandwidth covers the pre-5G and 3GPP standards evolution with EVM performance up to -40 dB for accurate device measurement.

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R&S®RTP Series digital oscilloscope is R&S new high-performance oscilloscope platform which currently offer up to 8GHz bandwidth and support future bandwidth and function upgrade. The high-performance R&S®RTP combines multiple instruments better than any other oscilloscope in its class. 16 logic channels, four voltage channels and four current measurement channels are available in addition to the analog oscilloscope channels. The R&S®RTP supports protocol analysis of serial bus interfaces and offers powerful spectrum and signal analysis functions. Thanks to its wide range of tools, users can test many different types of signals from complex circuits time-correlated with each other with just one T&M instrument, and find related errors faster. The new high-performance oscilloscope from Rohde & Schwarz addresses electronics developers in the wide-base market, particularly in the fields of aerospace and defense, automotive, industry and telecommunications. It is ideal for debugging electronic circuitries with different signals during development, including high-speed buses (USB, PCI Express, MIPI, etc.), multichannel RF interfaces (radio or radar), DDR memory interfaces, complex power management units, and even simple control and programming buses (I2C, SPI, etc.). The R&S®RTP can test all applications where high-resolution signals need to be measured with a wide dynamic range and high sensitivity in the time and frequency domains. The R&S®RTP high-performance oscilloscope family combines signal integrity with a high acquisition rate. In standard acquisition mode, it can measure a million waveforms per second, making it more than a thousand times faster than other oscilloscopes in its class. This helps users to find sporadic errors much faster. R&S®RTP is the first high bandwidth oscilloscope to cover signal integrity and power integrity test requirements with up to 1mV/div full-bandwidth hardware input sensitivity. It is the only instrument on the market that compensates transmission losses from the signal source to the oscilloscope (deembedding) in real time. The advantage is that the oscilloscope is still extremely fast even with signal correction activated. And, thanks to its unique digital trigger architecture, it can precisely trigger on compensated signals. A further feature of the R&S®RTP oscilloscope that saves developers a lot of time is hardware acceleration for a range of analysis functions. Mask tests, histograms and frequency domain analysis can be performed at high speed for fast results with high statistical reliability. Despite its comprehensive range of functions, the R&S®RTP is the most compact high-performance oscilloscope on the market, with a footprint up to 40 percent lower than conventional models. Thanks to the sophisticated cooling concept and the silent fans, the quiet instrument never disturbs lab operations.

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The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

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FormFactor’s Contact Intelligence technology combines smart hardware design and innovative software algorithms to provide accurate probe-to-pad alignment and electronic recalibrations in engineering labs and many production applications. Contact Intelligence enables true hands-free and autonomous RF calibrations and measurements over multiple temperatures.
• Probe-to-Pad Alignment correction technology uses image processing algorithms, microscopic imaging and precision positioning to intelligently correct alignment to compensate for any thermal expansion of the probes or device when changing temperature
• Velox software allows the system to automatically detect probe tip location with reference to probe pads and alignment marks on the calibration substrate. Velox then controls the programmable positioners to place the probes accurately on the pads or calibration standards for each touchdown
• WinCal XE calibration software continuously monitors calibration drifts and automatically recalibrates if the system performance drifts beyond a usable limit

Measurement of Silicon Photonics devices need optical as well as high speed digital capabilities. Contact Intelligence technology enables and optimizes Silicon Photonics coupling.
• 6 axis automated fiber positioning solution with high precision Piezo‐based nanometer resolution
• Flexible two stage fiber alignment solution with coarse and fine align suitable for engineering to production needs
• Replaceable fiber holders for single fibers or fiber arrays offered at a variety of angles
• integrated high precision Z displacement technique enables sub-micron level placement accuracy of the fibers and arrays when stepping die-to-die.
• Firmware driven high speed automated fiber alignment algorithms
• Customized scripting and test programs to optimize the system for fast, accurate measurements
• Formfactor’s SiPh software to simplify integration with Keysight’s Photonics Applications Suite and optical instrumentation for IL and IL/PDL measurements

Autonomous RF Device Modeling
Prior to 5G, devices were tested in many cases up to 30GHz, and temperature tests were not mandatory. Today’s high-frequency ICs for 5G/IoT applications incorporate multiple high frequency bands from sub-6 to more than 70 GHz. 5G/IoT devices need to be tested up to 100 GHz, with some foundries testing up to 120 GHz. Mandatory temperature tests up to 175C increase the level of difficulty. Significantly more devices need to be tested, especially active transistors. Normal testing of RF device modeling test structures requires large amounts of time from the engineer to perform re-calibrations whenever the system drifts beyond a usable limit, which is unavoidable with Vector Network Analyzers. Re-positioning of the probes when changing temperature, also requires user intervention. Contact Intelligence offers true hands-free and autonomous RF calibrations and measurements over multiple temperatures.
• Less experienced operators can perform an RF calibration up to 120 GHz by simply pushing a button.
• Measurements can be left running overnight or the weekend, testing all devices on the wafer, and at different temperatures without the need of an operator.
• The system will automatically re-align the probes to the pads if they drift from alignment.
• The system will continuously monitor calibration drift, and automatically re-calibrate the system should the drift exceed a predefined limit.

Autonomous SiPh Measurements

Typically, Silicon Photonics includes on-chip I/O devices which, along with electrical, add an entirely new dimension to wafer test methodologies. The need to capture and insert modulated beams of light requires the development of novel probing strategies that accommodate a new set of mechanical requirements. The classic problem of maintaining accurate physical probe contact with pads on the wafer surface gives way to a new paradigm when optical fibers must be precisely aligned to couple light in and out of a wafer without physical contact. FormFactor’s integrated production-proven SiPh solution allows sub-micron manipulation of optical fibers positioned above the wafer, automatically optimizing fiber coupling position. Contact Intelligence uses machine vision technology to automate Theta X, Y and Z axis calibrations and alignments enabling measurements out of the box, reducing what used to take days, weeks or months to a matter of minutes. These automated optical capabilities can also be combined with programmable DC and RF positioning technology to create the industry’s first truly automated Optical-Optical, Optical-Electrical, and Optical-Electrical-Optical test platform.

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CEVA Dragonfly NB1 is a Licensable NB-IoT Solution For Cost and Power-Sensitive LTE IoT Devices. The CEVA-Dragonfly NB1 pre-integrates together a CEVA-X1 processor, an optimized RF, a baseband, and a protocol software to offer a complete Release 13 Cat-NB1 modem IP solution that reduces time-to-market and lowers entry barriers. It eliminates the need for additional processors and hardware accelerators in the SoC and allows in-the-field upgrades to Release 14 eNB-IoT and other future releases.

The CEVA-Dragonfly NB1 is a fully software-configurable solution that can be extended seamlessly with GNSS and sensor fusion functionality.

It includes a reference silicon of the complete modem design, including an embedded CMOS RF transceiver, an advanced digital front-end, physical layer software, and a third party NB-IoT protocol stack (MAC, RLC, PDCP, RRC, and NAS).

Target applications are any company looking to make an NB-IoT enabled chip for applications such as eBikes, logistics tracking, wearables, medical sensors, smart cities, smart meters, industrial applications etc.

This fully integrated silicon reference design for NB-IoT and GNSS, lets customers focus on development and integration of application level software and use-case specific workloads with pre-integrated NB-IoT modem.

So effectively, companies with no previous experience in cellular connectivity, can license this complete solution from CEVA and “drop-in” to their product design, enabling full NB-IoT connectivity. No other company can offer a complete, platform IP that is silicon-proven and ready for production. As NB-IoT is one of the hottest technologies for IoT today, it’s extremely important for the market to have an IP solution for companies that don’t want to purchase an expensive module or separate chip for NB-IoT connectivity. Companies such as Sanechips and ASR Micro in China are already building NB-IoT chips based on our IP and we expect dozens of companies to introduce NB-IoT chips in the coming years, many of which will use our IP.

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Key Features：
1.Free, Easier, Friendly, and Powerful general drawing capabilities
2.Working Anywhere, Anytime, Any Device
3.Real-time Team Cooperation
4.Integrated PCB fabrication and Components purchase chain

Specifications： 1.Schematic Capture drawing no limitation
2.PCB Layout no limitation, 6 layers for now, 32 layers in the future
3.Simulation no limitation

Applications： 1.Small and medium electronic design for company
2.Electronic design teaching for school
3.Personal electronic design

Features:
1.Running on browser, don’t need to install to local, Working Anywhere, Anytime, Any Device, Any Operation System
2.Light weight, Running fast, first start up no more than 10s, second time only 2s
3.Projects are stored on cloud servers, but only owner and owner authorized partners can open the private files
4.Hosting on servers around the globe ensures multi-backup and guarantees complete safety
5.Quick online sharing and cooperation
6.Over 740,000 public libraries
7.Thousands of open source projects
8.Self-hosted deployment will be supported in the future

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AndesCore™ N25 is a 32-bit CPU IP core capable of both delivering high per-MHz performance and operating at high frequencies, at the same time taking only small gate count to implement. It is based on AndeStar™ V5m architecture, the very first mainstream ISA that offers RISC-V technology. It comes with options, including branch prediction for efficient branch execution, Instruction and Data caches, Local Memories for low-latency accesses, and ECC for L1 memory soft error protection. N25’s 5-stage pipeline is optimized for high operating frequency and small gate count. Features available to address wide variety of design requirements include PLIC and vectored interrupts for serving various types of system events, AXI 64-bit or AHB 64/32-bit bus, PowerBrake and WFI mode for low power and power management, and JTAG debug interface for development support. N25 is perfect for various applications, including networking and communications, advanced driver-assistance systems (ADAS), video and image processing, storage and media streaming and so on.

Performance

AndeStar™ V5m Instruction Set Architecture (ISA), compliant to RISC-V technology
Andes extensions, architected for performance and functionality enhancements
32-bit, 5-stage pipeline CPU architecture
16/32-bit mixable instruction format for compacting code density
Branch predication to speed up control code
Return Address Stack (RAS) to speed up procedure returns
Flexibly configurable Platform-Level Interrupt Controller (PLIC) for supporting wide range of system event scenarios
Enhancement of vectored interrupt handling for real-time performance
Advanced CoDense™ technology to reduce program code size

Flexibility
Easy arrangement of preemptive interrupts
StackSafe™ hardware to help measuring stack size, and detecting runtime overflow/underflow
ECC or Parity check on level-one memories for fault protection
Several configurations to tradeoff between core size and performance requirements
Power Management
PowerBrake technology to reduce peak power consumption from within the CPU
WFI (Wait For Interrupt) mode to enable SoC power management

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In September 2017, Imagination Technologies launched its first standalone hardware IP Neural Network Accelerator (NNA), PowerVR Series2NX. The Series2NX delivers high-performance computation of neural networks at very low power consumption in minimal silicon area. It’s highly scalable architecture enables it to carry out deep neural network inference based on a wide range of popular neural network frameworks. As deep neural networks (DNNs) continue to drive an explosion in technological progress across industries, NNAs are set to become a fundamental class of processor; as significant as CPUs and GPUs. Many have praised the Series2NX for its industry-leading specifications that will ensure it stays ahead of the competition. However, success doesn’t just happen. It takes a hard-working team to deliver a leading product from concept to design to a fully implemented and customer-ready product in just 14 short months with 20 potential customers evaluating it from around the world. Potential applications for NNAs are innumerable, but include: photography and predictive text enhancement in mobile devices; feature detection and eye tracking in AR/VR headsets; pedestrian detection and driver alertness monitoring in automotive safety systems; facial recognition and crowd behaviour analysis in smart surveillance; online fraud detection, content advice, and predictive UX; speech recognition and response in virtual assistants; and collision avoidance and subject tracking in drones.

Features:
• 2x the performance and half the bandwidth of nearest competitor
• First dedicated hardware solution with flexible bit depth support from 16-bit down to 4-bit
• Lowest bandwidth NN solution
• Architected to support multiple operating systems
• Includes hardware IP, software and tools

Benefits:
• The industry’s highest inference/mW IP cores to deliver the lowest power consumption
• The industry’s highest inference/mm2 IP cores to enable the most cost-effective solutions
• The industry’s lowest bandwidth solution* – with support for fully flexible bit depth for weights and data including low bandwidth modes down to 4-bit
• Industry-leading performance of 2048 MACs/cycle in a single core, with the ability to go to higher levels with multi core

The PowerVR Series2NX NNA is designed from the ground up as a dedicated inference engine across a range of markets such as mobile, surveillance, automotive and consumer systems, with a highly scalable architecture designed to power future solutions across many others. Companies building SoCs for these applications can integrate the PowerVR Series2NX NNA for high-performance computation of neural networks at very low power consumption in minimal silicon area.

Highlights:
• Industry-leading performance of 2048 MACs/cycle in a single core, with the ability to go to higher levels with multi core
• Highest inference/s/mm2 IP cores to enable cost-effective solutions
• Highest inference/s/W IP cores to deliver low power consumption
• First dedicated hardware solution with flexible bit depth support from 16-bit down to 4-bit
• Lowest bandwidth neural network solution
• Architected to support multiple operating systems, including Linux and Android
• Includes hardware IP, software and tools to provide a complete neural network solution for SoCs
• Efficiently runs all common NN computational layers

Depending on the computation requirements of the inference tasks, it can be used standalone – with no additional hardware required – or in combination with other processors such as CPUs and GPUs.

In devices such as mobile phones where a GPU is mandated, companies can use a PowerVR GPU to manage the classic vision processing algorithms and offload the neural net processing to the PowerVR 2NX NNA. Because of the performance density of the PowerVR NNA and the GPUs, companies can implement this combination in the same silicon footprint as a competing standalone GPU.

Architecture and features:

• Scalable architecture
-From 128 to 1024 16-bit and 256 to 2048 8-bit MACs/clock
-Multi-core allows scaling beyond 2048 8-bit MACs/clock
-Architected for creation of cores with different performance points and feature
sets to address multiple markets and applications

• Flexible bit-depth data type support

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Cadence® Tensilica® Vision Q6 DSP, its latest DSP for embedded vision and AI built on a new, faster processor architecture. The fifth-generation Vision Q6 DSP offers 1.5X greater vision and AI performance than its predecessor, the Vision P6 DSP, and 1.25X better power efficiency at the Vision P6 DSP’s peak performance. The Vision Q6 DSP is targeted for embedded vision and on-device AI applications in the smartphone, surveillance camera, automotive, augmented reality (AR)/virtual reality (VR), drone and robotics markets.
A deeper, 13-stage processor pipeline and system architecture designed for use with large local memories enable the Vision Q6 DSP to achieve 1.5GHz peak frequency and 1GHz typical frequency at 16nm, in the same floorplan area as the Vision P6 DSP. As a result, designers using the Vision Q6 DSP can develop high-performance products that meet increasing vision and AI demands and power-efficiency needs.
• An enhanced DSP instruction set results in up to 20 percent fewer cycles than the Vision P6 DSP for embedded vision applications/kernels such as Optical Flow, Transpose and warpAffine, and commonly used filters such as Median and Sobel
• 2X system data bandwidth with separate master/slave AXI interfaces for data/instructions and multi-channel DMA alleviates memory bandwidth challenges in vision and AI applications, and also reduces latency and overhead associated with task switching and DMA setup
• Backwards compatibility with the Vision P6 DSP, so customers can preserve their software investment for an easy migration
• Optional vector floating point unit (VFPU) also supports half precision (FP16)
The Vision Q6 DSP builds upon the highly successful Vision P6 DSP, which has been designed into leading mobile application processors including the Kirin 970 from HiSilicon. Both the Vision P6 DSP and the Vision Q6 DSP are designed for general-purpose embedded vision and on-device AI applications requiring performance ranging from 200 to 400 GMAC/sec. With its 384 GMAC/sec peak performance, the Vision Q6 DSP is well suited for high-performance systems and applications. The Vision Q6 DSP can be paired with the Vision C5 DSP for applications requiring greater than 384 GMAC/sec AI performance.

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Cadence® Virtuoso® System Design Platform, a formal, streamlined and automated co-design and verification flow between the Cadence Virtuoso platform and Allegro® and Sigrity™ technologies. This higher level of integration enables engineers to design concurrently across the chip, package and board. By automating what has until now been a manual process, the Virtuoso System Design Platform minimizes errors and can reduce layout versus schematic (LVS) time between IC and package from days to minutes.
Until now, advances in silicon technology have been sufficient for continued improvement in microelectronics products. Given the complexity of today’s chips, packages and boards, ICs based on both silicon and non-silicon materials are now required to design optimal high-performance systems. As a result, this trend is driving the need for engineers to integrate multiple heterogeneous technologies in a single product, affecting the performance and functionality of ICs and introducing a new set of challenges for semiconductor companies. To address these challenges, Cadence has developed a novel, cross-platform solution that streamlines and automates the design of a package or module featuring off-chip devices and multiple ICs based on differing process design kits (PDKs).
The Virtuoso System Design Platform allows IC designers to easily include system-level layout parasitics in the IC verification flow, enabling time savings by combining package/board layout connectivity data with the IC layout parasitic electrical model. The resulting automatically generated “system-aware” schematic can then be easily used to create a testbench for final circuit-level simulation. Until now, designers were only able to make changes after time-consuming manual checks involving spreadsheets and other ad hoc/manual methods, which can take days. By automating this entire flow, the Virtuoso System Design Platform eliminates the highly manual and error-prone process of integrating system-level layout parasitic models back into the IC designer’s flow, reducing days of work to mere minutes.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

Why vote for us

The Semiconductor Industry is going through a transformation with a new wave of chip designs, accelerated by market drivers such as automotive, artificial intelligence (AI), and internet of things (IoT). These new applications completely change chip hardware requirements with how information is collected, processed, and intelligent actions are taken based on the insights derived in real time. This impending drive for sensing, collecting, processing and learning has triggered a technology upsurge of innovation in chip design. With shrinking geometries and the advent of new process nodes, designers are breaking performance boundaries while at the same time adding more functionality to their chips. Designers are unleashing new architectures stimulating a whole new wave of chips and systems-on-chip (SoCs). These new designs are aggressively pushing chip performance, power, and area (PPA) as well as the time-to-market targets, making the traditional RTL-to-GDSII design flow obsolete.

Synopsys’ Fusion Technology transforms the RTL-to-GDSII design flow with the fusion of best-in-class optimization and industry-golden signoff analysis, enabling industry-best full-flow quality-of-results (QoR) and the fastest time-to-results (TTR). Fusion Technology enables one DNA backbone across the Synopsys Design Platform that includes IC Compiler™ II, Design Compiler® Graphical, PrimeTime®, StarRC™, IC Validator, DFTMAX™, TetraMAX® II, and Formality® tools. Fusion provides Design Fusion, ECO Fusion, Signoff Fusion, and Test Fusion technologies. Design Fusion enables synthesis technology inside place-and-route, and place-and-route technology inside synthesis for best QoR and faster design convergence. ECO Fusion drives faster signoff closure with the industry’s golden signoff analysis and ECO optimization enabled directly from within implementation. Signoff Fusion eliminates excessive design margin and over-design, using the golden signoff engines PrimeTime and StarRC for both optimization and signoff. Test Fusion is the combination of design, design-for-test (DFT), and automatic pattern generation (ATPG) technologies.

The new market and technology drivers are forcing a transformation to the traditional RTL-to-GDSII design flow. In the past, designers put together their own flows by cobbling together a set of disconnected tools or with loosely-coupled tools that feature connected and/or cloned engines through the flow. These convoluted flows are breaking down for leading edge advanced node designs as there are still clear lines of demarcation between the major phases of the design flow: Synthesis, Place-and-Route, Signoff. These functional boundaries inevitably cause major rework due to associated hiccups when transitioning from one design phase to the next leading to a non-linear, non-monotonic, non-convergent flow that is sub-optimal.

Fusion redefines conventional EDA tool boundaries across synthesis, place-and-route and signoff, sharing engines across the industry’s premier digital design products, and a unique, single data model for both logical and physical representation. At the heart of Fusion Technology is the Fusion Data Model—a single data model that fuses together both the logical and physical representations of the design. The Fusion Data Model serves all design phases and provides a unified foundation that is scalable, agile, and flexible. It enables faster tool-data model interaction, interactive what-if analysis, and native multi-everything (cores, corners, etc.) with near-linear scalability across multiple CPU cores. The Fusion Data Model also supports transparent, multi-level hierarchy and the efficiency to run compute-intensive algorithms, facilitating more optimizations for better QoR. Fusion delivers the most predictable RTL-to-GDSII flow with the fewest iterations, as well as unsurpassed design frequency, power, and area.

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The new updated Altium Designer significantly enhances user experience and productivity using a modern interface to streamline your design workflow, while enabling unprecedented performance optimization with 64-Bit architecture and multi-threading.

Powerful PCB Design
64-bit architecture and multi-threaded task optimizations let you design and release large, complex boards faster than ever.
• Design large, complex boards faster than ever with the assurance of never running out of memory.
• Leverage more efficient algorithms to significantly improve task execution, speed and design time on many common tasks - including online DRC, SCH compile, and polygon pour.

Modern Interface Experience
New, cohesive user interface provides a fresh and intuitive environment, and optimizations that enable unparalleled visualization of your design workflow.
Interconnected Multi-Board Assembly
Connectivity management and enhanced 3D engine allows you to render design models and multi-board assemblies – faster and with better shading and realism.
Fast and High-Quality Routing
Visual Constraints and user-guided automation enables you to route complex topologies across layers – routes at the speed of a computer, but the quality of a human.
Real-time BOM Management
Latest supplier part information linked to the BOM enables you to make educated design decisions – on your own timeline.
Seamless PCB Documentation Process
Document all assembly and manufacturing views in a single, cohesive design environment, with linked source data for updates at the push of a button.
Rigid-Flex board design
Altium Designer's unique native 3D PCB engine is the best choice for flexible PCB design and rigid-flex board designs.
As a powerful, unified electronic development environment, Altium Designer has been built that includes all the advanced tools for engineers to achieve high productive and efficient design. Altium Designer integrates database, component management, schematic capturing, electrical/design rules, verification, advanced PCB layout, native 3D PCB MCAD collaboration, design documentation, output generation, and BOM management, and integrates them into a uniform and tidy user Interface. Engineers do not need to learn several different tools to complete their work, and it is impossible to lose the fidelity of design data throughout the engineering, design, and release process.
Altium Designer's unique native 3D PCB engine is the best choice for flexible PCB design or Rigid-Flex board design. Through full 3D modeling, the work efficiency is improved while reducing design errors. Altium Designer is also an enterprise-level electronic design management platform. Project internal management, team-to-tean collaboration, and production data release management can all find suitable solutions on this platform.
The latest version of Altium Designer has a modern user interface, updated and enhanced ActiveRoute routing capabilities, ACTIVEBOM real-time BOM management, simplified design streamline, and multi-threaded architecture support, enabling engineers to design for greater efficiency and productivity than ever before. Engineers can also create interconnected multi-board projects with the new Altium Designer to quickly and accurately represent high density complex PCB assemblies.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views

Why vote for us

The Siemens PLM autonomous driving solution debuted in Spring of 2018 as a breakthrough solution for the development of autonomous driving systems. It minimizes the need for extensive physical prototyping while dramatically reducing the number of logged test miles necessary to demonstrate the safety of autonomous vehicles. Leveraging advanced, physics-based simulation and innovative sensor data processing technologies, the new Siemens solution is designed to help automakers and their suppliers address this industry challenge with the potential to shave years off the development, verification and validation of self-driving cars. The solution integrates autonomous driving technologies from recent Siemens acquisitions Mentor Graphics and TASS International. TASS’ PreScan™ simulation environment produces highly realistic, physics-based simulated raw sensor data for an unlimited number of potential driving scenarios, traffic situations and other parameters. The data from PreScan’s simulated LiDAR, radar and camera sensors is then fed into Mentor’s DRS360™ platform, where it is fused in real time to create a high-resolution model of the vehicle’s environment and driving conditions. Customers can then leverage the DRS360 platform’s superior perception resolution and high-performance processing to test and refine proprietary algorithms for critical tasks such as object recognition, driving policy and more. To deliver the most comprehensive and accurate solution possible, Siemens PLM Software is working with many of the world’s leading manufacturers of LiDAR, radar and vision sensing products to develop physics-based, 3D simulated versions of specific sensor modules. Compatible with the new Siemens toolchain, the simulated sensors are attuned using detailed design information from sensor suppliers, and validated using real-world measurement data for optimal accuracy.

Simulation technology is increasingly valuable to developers of automated vehicles as they face mounting pressures to speed development, validation, and performance of their AV solutions. Automotive engineers are quickly realizing that physical prototypes and road testing alone cannot reproduce the multitude of complex driving scenarios self-driving cars will encounter. In fact, many of the deadliest scenarios are impossible to reproduce, while others are so dangerous to reproduce that ethics preclude pre-testing. According to the findings of a recent report issued by the Rand Corporation, autonomous vehicle prototypes would have to be driven hundreds of millions of miles, and in some cases hundreds of billions of miles, over the course of several decades to demonstrate their reliability in terms of fatalities and injuries – an outcome the authors deemed inconsistent with the near-term commercial viability of self-driving cars. For solutions to these challenges, the researchers pointed to innovative testing methods such as advanced simulation technologies. It is clear that the near-term commercial availability of fully autonomous vehicles is highly dependent on advanced, physics-based simulation technologies, where Siemens is setting the pace for the larger worldwide automotive industry. Siemens now offers simulation solutions for each stage in the development process from sensors, to processors, to sub-systems, to the entire vehicle. Having a greater scope in simulation solutions offers Siemens the ability to play a leading role in the validation and verification of automated vehicle solutions.

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MPLAB® ICD 4, an in-circuit programming and debugging development tool for Microchip’s PIC® microcontroller and dsPIC® digital signal controller portfolios. The MPLAB ICD 4 includes all the features of the popular MPLAB ICD 3 debugger while adding increased speed through a faster processor and increased RAM. The MPLAB ICD 4’s significant improvement in speed is accomplished through a 32-bit MCU running at 300 MHz. The faster processing, along with an increased buffer memory of 2 MB, results in a product that is up to twice as fast as its predecessor. The puck-shaped MPLAB ICD 4 is housed in a durable, black case with a brushed aluminum top and is accented with an LED light strip to indicate debugging status. The tool features the following:

• A wider target voltage range, from 1.20 to 5.5 V
• An optional 1 Amp of power (using an external power supply)
• Selectable pull-up/pull-down option to the target interface
• Configurable interface speed for optimised programming and debugging
• Intelligent, robust interface with fault detection and immunity
• JTAG debugging capability

Microchip’s MPLAB ICD 4 is easy to use and supports all PIC microcontrollers and dsPIC digital signal controllers in Microchip’s portfolio through the MPLAB X Integrated Development Environment (IDE). This simplifies the design process for customers when they choose to migrate from one PIC MCU to another to meet the needs of their application. Speed and flexibility are the most important factors when selecting a debugging tool. The MPLAB ICD 4 reduces wait time—and in turn—improves debugging productivity. With speed, compatibility, durability, comprehensive device support and the award-winning MPLAB X IDE, the MPLAB ICD 4 again solidifies Microchip’s reputation as a leading provider of embedded debugging tools.

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The debugging process remains an important area where many embedded design engineers would like to see improvements. To address these needs and enhance the development experience, Microchip Technology Inc. has introduced the MPLAB® PICkitTM 4 In-Circuit Debugger. The low-cost PICkit 4 in-circuit programming and debugging development tool is meant to replace the popular PICkit 3 programmer by offering five times faster programming, a wider voltage range (1.2-5V), improved USB connectivity and more debugging interface options. In addition to supporting Microchip’s PIC® microcontrollers (MCUs) and dsPIC® Digital Signal Controllers (DSCs), the tool also supports debugging and programming for the CEC1702 family of hardware cryptography-enabled devices. This low-cost programming and debugging solution is ideal for those designing in the 8-bit space, but it is also perfectly suited for 16- and 32-bit development due, in part, to its 300 MHz, high-performance ATSAME70Q21B microcontroller on board. The benefits of faster programming time are less waiting and better productivity during development. This is especially important when designing with 32-bit microcontrollers with larger memory capacities. The PICkit 4 development tool enables debugging and programing using the graphical user interface of MPLAB X Integrated Development Environment (IDE). The tool connects to the design engineer's computer using a hi-speed USB 2.0 interface and can be connected to the target via an 8-pin single inline header that supports advanced interfaces such as 4-wire JTAG and serial wire debug with streaming data gateway. It is also backward compatible for demo boards, headers and target systems using 2-wire JTAG and In-Circuit Serial Programming™ (ICSP) compatibility. The new interfaces make this low-cost tool compatible with Microchip’s CEC1702 hardware cryptography-enabled devices. This low-power, but powerful, 32-bit MCU offers easy-to-use encryption, authentication and private and public key capabilities. CEC1702 users can now benefit from using Microchip’s development tools and support rather than being required to invest in third-party tools for programming and debugging.

The information above was provided by the nominee and does not represent the organizer's views

The information above was provided by the nominee and does not represent the organizer's views