Wei Shaojun is Professor at Tsinghua University in Beijing,China and serves as Vice Chairman of China Semiconductor Industry Association (CSIA) and Chairman of CSIA's IC Design Branch. He is Member of National IC Industry Development Advisory Committee, Fellow of Chinese Institute of Electronics (CIE) and IEEE Senior Member. He has previously served as Principal Engineer of Telecommunications Science and Technology Research Institute and CEO of Dantang Telecom Technology Co.

Prof. Wei received Master's degree in Engineering from Tsinghua University in Beijing in 1984, and PhD, Engineering from the Faculté Polytechnique de Mons in Belgium in 1991.

Jean-Marc Chery is STMicroelectronics’ President and Chief Executive Officer, and has held this position since May 31st, 2018. He is the Sole Member of ST’s Managing Board and chairs its Executive Committee.

Chery began his career in the Quality organization of Matra, the French engineering group. In 1986, he joined Thomson Semiconducteurs, which subsequently became ST, and held various management positions in product planning and manufacturing, rising to lead ST's wafer fabs in Tours, France, and later in Rousset, France. In 2005, Chery led the company-wide 6-inch wafer-production restructuring program before taking charge of ST’s Front-End Manufacturing operations in Asia Pacific. In 2008, he was promoted Chief Technology Officer and assumed additional responsibilities for Manufacturing and Quality (2011) and the Digital Product Sector (2012). In 2014, Chery was appointed ST's Chief Operating Officer responsible for the Company's Technology and Manufacturing operations.

Chery chairs the Board of STS, ST's manufacturing joint venture in China, and holds board membership at the European microelectronics R&D program AENEAS.

Jean-Marc Chery was born in Orleans, France, in 1960, and graduated with a degree in Engineering from the ENSAM engineering school in Paris, France.

Tyson Tuttle serves as the President and Chief Executive Officer of Silicon Labs, a leading provider of silicon, software and solutions for a smarter, more connected world. Since joining Silicon Labs in 1997, Tyson has shaped the company's strategic and technological direction. He helped design the company's first breakthrough IC product, which achieved market share leadership in PC modems and enabled the company to go public in 2000.

Tyson led the marketing effort behind Silicon Labs' first RF transceiver products for mobile handsets and spearheaded the development and market success of the company's radio and TV tuner ICs. Tyson also led Silicon Labs' broadcast product lines until 2010 when the R&D team was consolidated under his leadership as Chief Technology Officer. He became Chief Operating Officer in 2011, managing Silicon Labs' business units and R&D, and was promoted to CEO in 2012. In his C-level roles, Tyson spearheaded the company's focus on the Internet of Things, and has driven six strategic IoT acquisitions since taking the position of CEO. Tyson has more than 25 years of semiconductor experience with industry leaders like Broadcom and Cirrus Logic/Crystal Semiconductor, holds 70 patents in RF and mixed-signal IC design.

Tyson holds a BS in electrical engineering from Johns Hopkins University and an MS in electrical engineering from UCLA. He serves on the board of the Global Semiconductor Alliance and is a respected leader in the Austin community, serving as Chairman of the Board for KLRU-TV, home of PBS and Austin City Limits.

As a researcher, design architect, entrepreneur and chief executive, Dr. Lu has dedicated his career to the worldwide IC design and semiconductor industry. He is Chairman, CEO and Founder of Etron Technology and co-founded several other high-tech companies including Ardentec and Global Unichip Corporations.

Dr. Lu worked for the IBM Research Division and then the Headquarters from 1982 to 1990 and won numerous IBM recognition awards, including an IBM Corporate Award. He co-invented and pioneered a 3D-DRAM technology, known as the Substrate-Plate Trench-Capacitor (SPT) cell, along with its associated array architecture, which has been widely used by IBM and its licensees in 1Mb to 1Gb DRAMs and embedded DRAMs. Dr. Lu designed a High-Speed CMOS DRAM (HSDRAM) chip in 1984, 25 nano-second which is 3X faster than normal DRAMs, the concept of which becomes core technologies of many major DRAMs. In 2004 Etron developed another speed record: a 10 ns and 800 Gb/s HSDRAM. He was elected as an AdCom member of the IEEE Solid-State Circuits Society from 1977 to 1999, and is on the technical program committees of the IEEE International Solid States Circuits Conference (ISSCC) from 1988 to 2012 and of the Symposium on VLSI circuits since 1990. He is an IEEE Fellow, the recipient of the IEEE 1998 Solid-States Circuits Award, and a member of NAE (National Academy of Engineering of USA).

As a co-architect leading the 8-inch wafer and DRAM/SRAM/LOGIC technology developments for Taiwan's semiconductor industry in early 1990s, which later creates many Taiwan companies as prominent silicon chip suppliers, Dr. Lu was thus awarded the Taiwan’s Honorable Medal of Excellence in Science and Technology by the Premier. Since 1999 he has pioneered DRAM Known-Good-Die Memory products enabling customers' 3D stacked-die system chips. This work summoned the new rise of an IC Heterogeneous Integration Era as described in his plenary talk at the 2004 ISSCC, demonstrating a new 3D IC trend in parallel to the Moore's Law.

Dr. Lu received his B.S. in Electrical Engineering from the National Taiwan University and M.S. and Ph.D. in EE from Stanford University. He holds over 24 U.S. patents and has published more than 50 technical papers. He serves as Chairman of TSIA (Taiwan Semiconductor Industry Association), Chairman of Asia-Pacific Leadership Council for GSA (Global Semiconductor Alliance), and was Chairman of the Board Director of GSA (2009 to 2011) and Chairman of WSC (World Semiconductor Council) from 2014 to 2015. He is an Outstanding Alumnus of National Taiwan University, and a Chair Professor and an Outstanding Alumnus of National Chiao Tung University.

José Franca is a Partner - Head of Iberia at Keensight Capital. José's relationship with Keensight Capital dates back over 12 years.

In 1997, José created Chipidea, a former Keensight Capital portfolio company. As CEO, José developed Chipidea on a global basis to create the number one analog semiconductor IP company worldwide which was eventually acquired by MIPS Technologies (NASDAQ) in 2007. In 2012, José was Government-appointed Chairman and CEO of Private Equity firms INOV Capital, Turismo Capital and AICEP Capital Global which he then merged to create Portugal Ventures. In addition, José was Chairman of PME Investimentos, the leading Fund-of-Funds manager in Portugal, and board member of several international innovative companies.

He was also State Secretary of Education in the Portuguese government (1991 – 1992).
José holds a Ph.D. in Electrical Engineering.

Maurice Geraets MSc MBA is Managing Director at NXP Semiconductors Netherlands B.V. and Vice President of Innovation. Maurice has 25 years of experience in the IT and electronics industry and has worked at NXP Semiconductors since 2002. In his current position he focuses on disruptive innovations that enable the secure connections for a smarter world. This includes areas such as intelligent transport systems (ITS) and automated driving.

In addition to his role at NXP, Maurice is also active in the governance of the 1 billion Euro Dutch SmartwayZ program and is board member of several associations on automotive and mobility. He is a member of the High Level ITS Advisory Group to the European Commission and the management committee of the European public private partnership AENEAS.

Before joining NXP, Mr. Geraets held positions as Business Manager In-Product Software and Global Client Manager with Atos, the largest European IT services company. In his Global Client Manager role, he was also responsible for the largest part of the Atos business in Asia. In his early working life Mr. Geraets served as Lieutenant in the Royal Dutch Navy.

Mr. Geraets holds an Executive MBA degree and a Master of Science degree in Computer Science.

Luca is the co-founder of Prophesee and has served as the company's Chief Executive Officer since 2014.

He has extensive international management experience and a background in the automotive and electronic industries. His experience includes project and product management, marketing and business development roles at Schneider Electric.

Prior to Schneider Electric, Luca worked as an engineer with Toyota and Altis Semiconductor as well as a Research Assistant in Photonics at the Imperial College of London.

Luca holds a double first-class MSc in Physics, Electronic and Industrial Engineering from Politecnico di Milano and Ecole Centrale and an MBA from INSEAD.

Since 2015, Paul Boudre has been chief executive officer and board member of Soitec, a world leader in designing and manufacturing innovative semiconductor materials. He joined the company in 2007 as executive vice president of sales, marketing and business development, focusing on new market opportunities and building the silicon-on-insulator (SOI) ecosystem to enable SOI adoption for consumer and "More Than Moore" applications.

Besides leading Soitec, Paul Boudre serves on the boards of directors for FOGALE nanotech, a leader in advanced metrology solutions; Exagan, a producer of gallium-nitride power switches; AENEAS, the Association for European NanoElectronics Activities; and the SOI Industry Consortium, an international organization that he played a role in launching in 2007 to promote understanding, development and adoption of SOI-based technologies. He also is a member of the European Advisory Board of SEMI, the global industry association serving the electronics manufacturing supply chain.

During his more than three decades in the global semiconductor industry, Paul Boudre spent nearly 10 years at KLA-Tencor, one of the world's top five semiconductor equipment manufacturers. He first managed the company's European operations and subsequently was named executive vice president for both the U.S. and Europe. In addition, he has managed industrial operations for IBM Semiconductor, now part of GlobalFoundries; STMicroelectronics; Motorola Semiconductor, now part of NXP Semiconductors; and Atmel.

He holds a graduate degree in chemistry from France's Ecole Nationale Supérieure de Chimie de Toulouse.

Dr. Wayne Wei-Ming Dai founded VeriSilicon in August 2001 and has served as the chairman of the board of directors, President and Chief Executive Officer since then. Prior to VeriSilicon, Dr. Dai was the Co-Chairman and Chief Technology Officer of Celestry Technologies, Inc., an EDA company, which was acquired by Cadence Design Systems in 2002. Prior to that, he was the founder, chairman of the board of directors, and Chief Executive Officer of Ultima Interconnect Technology, Inc., one of the predecessor companies to Celestry.

Dr. Dai was the founding Chairman of the IEEE Multi-Chip Module Conference and the founding Chairman of IEEE Symposium on IC/Package Design Integration. He was an Associate Editor for IEEE Transactions on Circuits and Systems and an Associate Editor for IEEE Transactions on VLSI Systems. He has published over 100 papers in technical journals and conferences and received the NSF Presidential Young Investigator Award from the President of United States in 1990. He was elected as one the top ten venture-backed entrepreneurs in China in 2005, and elected as one of the 2005 top ten talents of science and technology in China. In 2007, he was recognized as The Ernst & Young Entrepreneur of the Year in China. In 2013, he was honored as The Executive of the Year of 2013 ACE Award. In 2014, he was awarded “Hurun Industry Achievement Award 2014”. He is currently the Executive Vice President of International Union for Science and Technology Innovation, the Vice President of China Semiconductor Industry Association IC Design Branch, and the President of Berkeley Shanghai Club.

Dr. Dai received his B.A. degree in Computer Science and his Ph.D. degree in Electrical Engineering, both from the University of California at Berkeley. He was a professor in the department of Computer Engineering at the University of California at Santa Cruz.

Victor Peng is President and Chief Executive Officer of Xilinx. He also serves as a member of the Board of Directors of Xilinx. Peng has over 30 years of experience defining and bringing to market leadership FPGAs, SoCs, GPUs, high performance microprocessors and chip sets, and microprocessor IP products.

In his previous role as Chief Operating Officer, Peng managed Global Sales, Product & Vertical Marketing, Product Development, and Global Operations & Quality. Prior to that, he served as Executive Vice President & General Manager of Products at Xilinx, and led the definition, development, and product marketing of the company’s portfolio of products and differentiated technologies – resulting in three consecutive generations of core product leadership and significant industry breakouts in integration and programming.

Before joining Xilinx, Peng served as Corporate Vice President of the graphics products group (GPG) silicon engineering with AMD, where he also served as a key leader for AMD's central silicon engineering team supporting graphics, console game products, CPU chipset and consumer business units. Prior to that, Peng held executive and engineering leadership roles at TZero Technologies, MIPS Technologies, SGI and Digital Equipment Corp.

Peng earned a BSEE from Rensselaer Polytechnic Institute and an M.Eng. in Electrical Engineering from Cornell University. He holds four U.S. patents.